EP3SE80F1152C4 vs EP3SE80F1152C3N 比較
詳細並排比較 EP3SE80F1152C4 由 Intel 與 EP3SE80F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE80F1152C4 | EP3SE80F1152C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III Enhanced | — |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3200 | — |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS |
| Internal Frequency (max) | 800 MHz | — |
| 工作溫度 | 0C to +85C (Commercial) | 0C to +85C (commercial, C3 grade) |
| 封裝 | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | — |
| RoHS 狀態 | Compliant | Compliant |
| Logic Elements (LEs) | — | 80,000 |
| Total Memory Bits | — | 6,843,392 bits |
| Number of LABs/CLBs | — | 3200 |
| Number of User I/O | — | 744 |
| 輸出數量 | — | 744 |
| 封裝 / 外殼 | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed/Power Grade | — | C3 |
| Lead Free | — | Yes |
| MSL 等級 | — | 3 (per JEDEC J-STD-020) |
| Configuration Memory | — | SRAM-based, volatile (needs external config device) |