EP3SE80F1152C4 vs EP3SE80F1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C4 sa pamamagitan ng Intel at EP3SE80F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
EP3SE80F1152C4 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP3SE80F1152C4 | EP3SE80F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III Enhanced | — |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3200 | — |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm CMOS | 40 nm CMOS |
| Internal Frequency (max) | 800 MHz | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial, C3 grade) |
| Packhaging | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 80,000 |
| Total Memory Bits | — | 6,843,392 bits |
| Number of LABs/CLBs | — | 3200 |
| Number of User I/O | — | 744 |
| Bilang ng Outputs | — | 744 |
| Packhaging / Kaso | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed/Power Grade | — | C3 |
| Lead Free | — | Yes |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Memory | — | SRAM-based, volatile (needs external config device) |