EP3SL70F484C2G vs EP3SL70F484C4 比較

詳細並排比較 EP3SL70F484C2G 由 Intel 與 EP3SL70F484C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL70F484C4 EP3SL70F484C4 - Stratix III L FPGA 67500 LE | Intel

EP3SL70F484C4 - Stratix III L FPGA 67500 LE | Intel

EP3SL70F484C4 ✓ 啟用中

規格比較

參數 EP3SL70F484C2G EP3SL70F484C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Stratix III L —
Logic Elements 67,500 —
Adaptive Logic Modules (ALMs) 27,000 —
Embedded Memory 2,699,264 bits (2.57 Mbit) —
Number of I/Os 296 —
封裝 484-ball FCBGA —
安裝類型 Surface Mount (SMD/SMT) —
Core Supply Voltage 1.1 V 1.1 V
Process Technology 65 nm —
Speed Grade 2 —
工作溫度 0 °C to +85 °C (commercial) —
Transceivers [DATA_NEEDED: transceiver count and data rate] —
DSP Blocks [DATA_NEEDED: DSP block count] —
PLLs [DATA_NEEDED: PLL count] —
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] —
Lead-Free [DATA_NEEDED: lead-free status] —
MSL 等級 [DATA_NEEDED: MSL rating] —
Configuration Scheme [DATA_NEEDED: configuration mode] —
Manufacturer — Intel (Altera)
Series — Stratix III L
Device Type — FPGA
Number of Logic Elements/Cells — 67500
Number of LABs/CLBs — [DATA_NEEDED: Number of LABs/CLBs]
Total RAM Bits — 2699264
Number of DSP Blocks — [DATA_NEEDED: Number of DSP blocks]
Number of User I/O — 296
Number of Terminations — 484
封裝 / 外殼 — 484-BBGA, FCBGA
Package Shape — Square
Terminal Form — BALL
Technology Node — 65 nm
Internal Frequency (marketplace listing) — 800 MHz
工作溫度範圍 — 0°C to 85°C
Packaging — Tray
濕度敏感等級 (MSL) — 3 (168 Hours)
Lead-Free Status — Lead Free
ECCN — [DATA_NEEDED: ECCN]

資料表與資源

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