EP3SL70F484I3 vs EP3SL70F484I3N 比較

詳細並排比較 EP3SL70F484I3 由 Intel 與 EP3SL70F484I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL70F484I3 EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 ⚠ 最後購買機會

規格比較

參數 EP3SL70F484I3 EP3SL70F484I3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III L —
Logic Elements 67,500 —
Adaptive Logic Modules (ALMs) 33,000 —
Logic Array Blocks (LABs) 2,700 —
Total Embedded Memory 2,699,264 bits (337 KB) —
M9K Memory Blocks 288 —
M144K Memory Blocks 12 —
DSP Blocks (18x18 multipliers) 384 —
User I/O Pins 296 —
Transceivers Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] —
PLLs 8 (4 enhanced PLLs + 4 fast PLLs) —
Process Node TSMC 40 nm —
Speed Grade -3 (mid-tier) 3
工作溫度 -40C to +100C (industrial) -40C to +100C (TJ)
封裝 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch —
Configuration Modes FPP, AS, PS, JTAG, AES encryption —
Design Software Quartus II (legacy) —
RoHS 狀態 Compliant [DATA_NEEDED: per datasheet]
Series — Stratix III L
Logic Elements / Cells — 67,500
Number of LABs / CLBs — 2,700
Total RAM Bits — 2,699,264
Number of I/O — 296
封裝 / 外殼 — 484-BBGA, FCBGA
Supplier Device Package — 484-FBGA (23x23 mm)
安裝類型 — Surface Mount
Voltage - Supply — [DATA_NEEDED: core and I/O supply voltages]
Process Technology — 40 nm CMOS
DSP Blocks — [DATA_NEEDED: exact count for EP3SL70]
Number of Transceivers — [DATA_NEEDED: transceiver count for this speed grade]
Product Status — Obsolete (per Assypcb listing)
濕度敏感等級 (MSL) — [DATA_NEEDED: MSL rating]
Temperature Grade — Industrial (I)

資料表與資源

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