EPF10K250EFC672-3 vs EPF10K200EFC672-3 比較

詳細並排比較 EPF10K250EFC672-3 由 Intel 與 EPF10K200EFC672-3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPF10K250EFC672-3 EPF10K200EFC672-3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Product Type FPGA (Field Programmable Gate Array) —
Family FLEX 10KE —
Maximum Typical Gates 250,000 —
Logic Elements (LEs) 12,160 —
Embedded Memory (EAB) 655,360 bits (80 EABs x 2,048 bits each) —
Logic Array Blocks (LABs) 392 (8 LEs per LAB) —
User I/O Pins 470 —
Core Supply Voltage 2.5 V —
I/O Supply Voltage MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Speed Grade -3 (fastest) —
Temperature Grade Commercial (0C to +70C) —
封裝 672-ball FineLine BGA (FC) —
Ball Pitch 1.0 mm —
Configuration Mode JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM —
Process Technology 0.25 um CMOS, 5-layer metal 0.22 µm CMOS
安裝類型 Surface Mount Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] [DATA_NEEDED: rohs status]
Lead-Free [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Series — FLEX 10KE
Number of Logic Elements / Cells — 9,984
Number of LABs / CLBs — 1248
Total RAM Bits — 98,304 bits (12 EABs of 8 Kbits)
Number of I/O — 470
Number of Gates (typical) — 200,000
Supply Voltage - Operating — 2.3 V to 2.7 V (2.5 V nominal)
Maximum Operating Frequency — 166.67 MHz
Propagation Delay — 0.4 ns
封裝 / 外殼 — 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA)
工作溫度 — 0 °C to +70 °C (commercial)
Configuration Memory — SRAM-based (volatile, requires external configuration device)
Number of PLLs — 4
MSL 等級 — [DATA_NEEDED: MSL level]

資料表與資源

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