H5AN8G8NCJR-XNC vs H5ANAG8NBJR-RDC 比較

詳細並排比較 H5AN8G8NCJR-XNC 由 SK hynix 與 H5ANAG8NBJR-RDC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN8G8NCJR-XNC H5AN8G8NCJR-XNC - 8Gb DDR4-3200 SDRAM, x8, FBGA-78 | SK hynix

H5AN8G8NCJR-XNC - 8Gb DDR4-3200 SDRAM, x8, FBGA-78 | SK hynix

H5AN8G8NCJR-XNC ✓ 啟用中
SK hynix
H5ANAG8NBJR-RDC H5ANAG8NBJR-RDC - 16Gb DDR4 SDRAM 2Gx8 2666 | SK hynix

H5ANAG8NBJR-RDC - 16Gb DDR4 SDRAM 2Gx8 2666 | SK hynix

H5ANAG8NBJR-RDC ✓ 啟用中

規格比較

參數 H5AN8G8NCJR-XNC H5ANAG8NBJR-RDC
品牌 SK hynix SK hynix
類別 Memory ICs DRAM
生命週期狀態 啟用中 啟用中
單價 (USD) $30.69 —
記憶體類型 DDR4 SDRAM DDR4 SDRAM
記憶體容量 8 Gbit —
組織 1 Gb x 8 2G x 8
資料速率 3200 Mbps (DDR4-3200) —
Clock Frequency 1.6 GHz —
供應電壓 1.14 V to 1.26 V (1.2 V nominal) —
封裝 78-ball FBGA, 7.5 mm x 11 mm 78-ball FBGA
工作溫度 0 C to +85 C [DATA_NEEDED: Operating Temperature Range]
安裝類型 Surface Mount Surface Mount
介面 DDR4 (8-bit data interface) SSTL12
Architecture Bank-group based DDR4 —
Refresh Auto self-refresh Self-refresh and auto-refresh (8K/64ms class per family datasheet)
Precharge Auto precharge —
On-Chip Termination Dynamic ODT —
Calibration ZQ calibration, write leveling —
Error Handling CRC function —
Reset Asynchronous reset —
Data Mask Data mask function —
Current - Operating 39 mA —
Current - Standby 30 mA —
RoHS 狀態 Compliant Compliant (lead-free PBGA per family product data)
Lead-Free / Halogen-Free Yes —
Density — 16 Gbit
Supply Voltage (VDD) — 1.2 V
I/O Voltage (VDDQ) — 1.2 V
Speed Grade (suffix R) — DDR4-2666 class
Bank Groups — 4 (per 16Gb DDR4 family datasheet)
Data Strobe — DQS with read/write training
Data Bus Inversion — Supported (DBI)
CAS 延遲 — [DATA_NEEDED: CAS Latency]
生命週期狀態 — Active

資料表與資源

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