K3KL3L30CM-BGCT vs K3LKBKB0BM-MGCP 比較
詳細並排比較 K3KL3L30CM-BGCT 由 Samsung Electronics 與 K3LKBKB0BM-MGCP 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3KL3L30CM-BGCT | K3LKBKB0BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 單價 (USD) | — | $46.62 |
| 記憶體類型 | LPDDR5X SDRAM | DRAM (LPDDR5 SDRAM) |
| Density | 64 Gbit | — |
| 組織 | x64 | 1G x 32 |
| Speed Grade | LPDDR5X-7500 (7500 MT/s) | — |
| Technology | Stacked DRAM die, mobile BGA | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 封裝 | [DATA_NEEDED: exact package code and ball count] | FBGA-315 |
| Core Voltage | [DATA_NEEDED: VDD core voltage] | — |
| I/O Voltage (VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Refresh | [DATA_NEEDED: refresh scheme] | Self-refresh and auto-refresh (LPDDR5 standard) |
| Standards Compliance | JEDEC LPDDR5X specification | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Application Class | Mobile / embedded main memory | — |
| 記憶體容量 | — | 32 Gbit |
| 資料速率 | — | 6400 Mbps per pin |
| Supply Voltage Rails | — | 500 mV, 900 mV, 1.05 V, 1.8 V |
| 介面 | — | LPDDR5 x32 |
| Technology Generation | — | LPDDR5 (JEDEC LPDDR5 family) |
| Density per Package | — | 4 GB (32 Gbit) |
| Application Segment | — | Mobile, embedded, industrial computing |
| Standby / Deep Sleep | — | LPDDR5 deep-sleep power states |
| Access Time / Latency | — | [DATA_NEEDED: CAS latency] |