K3LK8K80CM-MFCP vs K3LK4L40DM-BGCT 比較
詳細並排比較 K3LK8K80CM-MFCP 由 Samsung Electronics 與 K3LK4L40DM-BGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics
K3LK4L40DM-BGCT ✓ 啟用中規格比較
| 參數 | K3LK8K80CM-MFCP | K3LK4L40DM-BGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | DRAM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 SDRAM | DRAM (SDRAM component) |
| Density | 48 Gbit (6 GB) | [DATA_NEEDED: Density] |
| 組織 | [DATA_NEEDED: organization (x width)] | — |
| Pin Speed | 6400 Mbps | — |
| Data Rate (package) | 51.2 GB/s (family max) | — |
| 介面 | LPDDR5 (JESD209-5 class low-power DRAM interface) | — |
| 封裝 | 315-ball FBGA (MFCP) | — |
| Ball Count | 315 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40 C to +105 C (automotive-grade) | [DATA_NEEDED: Operating Temperature Range] |
| 供應電壓 | [DATA_NEEDED: VDD/VDDQ voltage] | — |
| Power Saving vs LPDDR4X | Approximately 20% | — |
| Generation | LPDDR5 (5th generation low-power DRAM) | — |
| Application Grade | Automotive-grade storage chip | — |
| Place of Origin | Johor, Malaysia | — |
| RoHS 狀態 | unknown | [DATA_NEEDED: RoHS Status] |
| Manufacturer | — | Samsung Electronics |
| Organization (x-width) | — | [DATA_NEEDED: Organization] |
| 資料速率 | — | [DATA_NEEDED: Data Rate] |
| Supply Voltage Class | — | [DATA_NEEDED: Supply Voltage] |
| CAS 延遲 | — | [DATA_NEEDED: CAS Latency] |
| Package Type | — | BGA (per -BGC ordering-code suffix) |
| Package Ball Count | — | [DATA_NEEDED: Ball Count] |
| Refresh Rate | — | [DATA_NEEDED: Refresh Interval] |
| Lead Free | — | [DATA_NEEDED: Lead-Free Status] |
| MSL 等級 | — | [DATA_NEEDED: Moisture Sensitivity Level] |
| Packaging | — | Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] |