K4RBH165VB-BCWM vs K4RHE086VB-BCWM 比較

詳細並排比較 K4RBH165VB-BCWM 由 Samsung Electronics 與 K4RHE086VB-BCWM 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4RBH165VB-BCWM K4RBH165VB-BCWM - 16Gb DDR5 SDRAM 1.1V FBGA | Samsung

K4RBH165VB-BCWM - 16Gb DDR5 SDRAM 1.1V FBGA | Samsung

K4RBH165VB-BCWM ✓ 啟用中
Samsung Electronics
K4RHE086VB-BCWM K4RHE086VB-BCWM - 24Gb DDR5 5600Mbps DRAM | Samsung

K4RHE086VB-BCWM - 24Gb DDR5 5600Mbps DRAM | Samsung

K4RHE086VB-BCWM ✓ 啟用中

規格比較

參數 K4RBH165VB-BCWM K4RHE086VB-BCWM
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR5 SDRAM DDR5 SDRAM
Density 16 Gbit 24 Gb
組織 1G x 16 2G x 8
Supply Voltage (VDD) 1.1 V —
Data Rate Class DDR5 5600 Mbps (family per Octopart listing of sibling part) —
封裝 FBGA-106 82 FBGA
安裝類型 Surface Mount Surface Mount
工作溫度 0C to +85C [DATA_NEEDED: operating temperature range]
On-Die ECC Yes [DATA_NEEDED: on-die ECC support]
Write CRC Yes —
Write Leveling Yes —
Auto Self-Refresh Yes —
Asynchronous Reset Yes —
Operating Mode DLL Enabled —
RoHS 狀態 Compliant unknown
Lead Free Yes —
MSL 等級 [DATA_NEEDED: MSL Level] —
Refresh Rate [DATA_NEEDED: Refresh Rate] —
資料速率 — 5600 Mbps
供應電壓 — 1.1 V
介面 — DDR5 (JEDEC)
Configuration — x8
Application Segment — Server / Data Center / Premium PC
Manufacturer — Samsung Semiconductor
Access Time / CAS Latency — [DATA_NEEDED: CAS latency]
Package Height — [DATA_NEEDED: package height]

資料表與資源

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