K9PDG08U5M vs K9UMGB8U7M 比較

詳細並排比較 K9PDG08U5M 由 Samsung Electronics 與 K9UMGB8U7M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停產
Samsung Electronics
K9UMGB8U7M K9UMGB8U7M - Samsung NAND Flash Memory | Samsung Electronics

K9UMGB8U7M - Samsung NAND Flash Memory | Samsung Electronics

K9UMGB8U7M ✓ 啟用中

規格比較

參數 K9PDG08U5M K9UMGB8U7M
品牌 Samsung Electronics Samsung Electronics
類別 EEPROM Memory ICs
生命週期狀態 停產終止 啟用中
記憶體類型 NAND Flash (SLC) NAND Flash
Density 4 Gbit [DATA_NEEDED: Memory Density]
組織 x8 (multiplexed I/O) [DATA_NEEDED: Memory Organization]
供應電壓 [DATA_NEEDED: supply voltage range] [DATA_NEEDED: Supply Voltage]
封裝 TSOP1-48 [DATA_NEEDED: Package Type]
安裝類型 Surface Mount [DATA_NEEDED: Mounting Type]
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: Page Size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: Block Size]
Page Read Time [DATA_NEEDED: page read time] —
Page Program Time [DATA_NEEDED: page program time] —
Block Erase Time [DATA_NEEDED: block erase time] —
Access Interface Asynchronous multiplexed address/data, CLE/ALE control —
Ready/Busy Output Yes (R/B, open-drain) —
Write Protect Pin Yes (/WP) —
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature Range]
Endurance [DATA_NEEDED: program/erase cycles] [DATA_NEEDED: Program/Erase Cycles]
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
Manufacturer — Samsung Electronics
Family — K9U series NAND Flash
Data Interface — [DATA_NEEDED: Data Interface]
Cell Type — [DATA_NEEDED: Cell Type (SLC/MLC/TLC)]
Read Time — [DATA_NEEDED: Read Time]
Program Time — [DATA_NEEDED: Program Time]

資料表與資源

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