LPC55S26JBD64Y vs LPC5528JBD64K 比較

詳細並排比較 LPC55S26JBD64Y 由 NXP Semiconductors 與 LPC5528JBD64K 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
LPC55S26JBD64Y LPC55S26JBD64Y - 150MHz Cortex-M33 MCU 256KB | NXP

LPC55S26JBD64Y - 150MHz Cortex-M33 MCU 256KB | NXP

LPC55S26JBD64Y ✓ 啟用中
NXP Semiconductors
LPC5528JBD64K LPC5528JBD64K - Cortex-M33 150MHz 512KB Flash MCU | NXP

LPC5528JBD64K - Cortex-M33 150MHz 512KB Flash MCU | NXP

LPC5528JBD64K ✓ 啟用中

規格比較

參數 LPC55S26JBD64Y LPC5528JBD64K
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Processor ARM Cortex-M33 ARM Cortex-M33 (r0p3)
Core Size 32-Bit 32-Bit
最大時脈頻率 150 MHz 150 MHz
Program Flash Memory 256 KB (256K x 8) —
供應電壓 3.3 V 3.3 V
封裝 64-HTQFP (10 x 10 mm), exposed pad 64-HTQFP (10x10 mm) with exposed pad
安裝類型 Surface Mount (Gull Wing terminals) Surface Mount
Temperature Grade Industrial —
Product Series LPC552x / LPC55S2x —
Process Technology 40-nm NVM 40-nm NVM
Number of Terminals 64 —
Package Shape Square —
SRAM Size [DATA_NEEDED: SRAM size] —
工作溫度範圍 [DATA_NEEDED: operating temperature range] —
Peripheral Compatibility Pin-, software- and peripheral-compatible with LPC552x/S2x family —
RoHS 狀態 [DATA_NEEDED: RoHS status] —
Flash Memory — 512KB (512K x 8)
SRAM — [DATA_NEEDED: SRAM size]
工作溫度 — -40C to +105C
Packaging — Tray
Memory Protection Unit — Yes (MPU)
Interrupt Controller — NVIC (built-in)
NMI Input — Yes, with selectable sources
Platform — NXP EdgeVerse
Peripherals / Connectivity — [DATA_NEEDED: peripheral set]
GPIO Count — [DATA_NEEDED: GPIO count]

資料表與資源

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