M1AFS250-FG256 vs M1AFS250-2FGG256I 比較
詳細並排比較 M1AFS250-FG256 由 Microchip Technology 與 M1AFS250-2FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ 啟用中Microchip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ 啟用中規格比較
| 參數 | M1AFS250-FG256 | M1AFS250-2FGG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer Part Number | M1AFS250-FG256 | — |
| Family | Fusion (M1 series, ARM Cortex-M1) | Actel Fusion (Mixed-Signal FPGA) |
| System Gates | 250000 | 250000 gates |
| Logic Cells | 6144 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 |
| 最大時脈頻率 | 350 MHz | — |
| Number of I/O | 114 | — |
| RAM Bits | 36864 | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (nonvolatile) | — |
| 工作溫度範圍 | 0C to +70C | — |
| 封裝 / 外殼 | 256-FBGA (256-LBGA), 1.00 mm pitch | — |
| 安裝方式 | SMD/SMT | — |
| Packaging | Tray | — |
| RoHS 狀態 | RoHS Non-Compliant (contains lead) | Compliant (FGG = Pb-free balls) |
| Lead Free Status | Contains Lead | — |
| Series | M1AFS250 | — |
| Registers (DFFs) | — | 36864 |
| User I/Os | — | 114 |
| Configuration Technology | — | Flash-based, nonvolatile |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -2 |
| 封裝 | — | 256-ball FBGA (FGG256) |
| 安裝類型 | — | Surface Mount |
| 工作溫度 | — | -40C to +85C (industrial, I grade) |
| Security | — | 128-bit Flash lock, AES decryption |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |