M7AFS600-1FG484I vs M7AFS600-FG484 比較

詳細並排比較 M7AFS600-1FG484I 由 Microchip Technology 與 M7AFS600-FG484 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-1FG484I M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I ✓ 啟用中
Microchip Technology
M7AFS600-FG484 M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip

M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip

M7AFS600-FG484 ✓ 啟用中

規格比較

參數 M7AFS600-1FG484I M7AFS600-FG484
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
System Gates 600000 600K
Programmable Logic Tiles 110592 —
User I/O 172 —
Family Fusion (Flash FPGA with optional ARM CoreMP7 support) —
Process Technology 130 nm, 7-layer metal, Flash-based CMOS —
Configuration Memory Nonvolatile Flash, retains program when powered off —
Power-Up Feature Live at Power-Up (LAPU) —
Supply Voltage (Core) 1.5 V —
Logic Family CMOS —
Speed Grade 1 —
封裝 484-ball FBGA (FG484), 23 x 23 x 2.44 mm —
Ball Pitch 1.0 mm —
工作溫度 Industrial, -40C to +85C —
安裝類型 Surface Mount —
Embedded Processor Support ARM CoreMP7 —
RoHS 狀態 Compliant —
Manufacturer Part Number — M7AFS600-FG484
Series — M7AFS600 (Fusion)
Logic Elements (VersaTiles) — 110592
Number of I/Os — 172
Embedded Processor — ARM CoreMP7
工作電源電壓 — 1.5 V
Technology — 130 nm Flash
Maximum Operating Frequency — 1098.9 MHz
封裝 / 外殼 — 484-ball FBGA (FG484)
Package Dimensions — 23 x 23 x 2.44 mm
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +70 C
安裝方式 — SMD/SMT
Packaging — Tray
RoHS Compliant — Yes
Programmability Type — In-System Programmable (flash-based, non-volatile)

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