M7AFS600-2FGG256 vs M7AFS600-1FGG256I 比較

詳細並排比較 M7AFS600-2FGG256 由 Microchip Technology 與 M7AFS600-1FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-2FGG256 M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip

M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip

M7AFS600-2FGG256 ✓ 啟用中
Microchip Technology
M7AFS600-1FGG256I M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I ✓ 啟用中

規格比較

參數 M7AFS600-2FGG256 M7AFS600-1FGG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion Mixed-Signal FPGA Fusion (Mixed-Signal Flash FPGA)
System Gates 600K 600K
Processor Core ARM CoreMP7 ARM CoreMP7
User I/O 119 —
Dedicated Logic Bits 110592 bits —
Speed Grade -2 -1
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) —
Technology 130 nm flash-based —
Configuration Flash-based (nonvolatile, instant-on) —
封裝 256-LBGA (FBGA-256, 17x17 mm) —
安裝類型 Surface Mount (SMD/SMT) —
工作溫度 0C to +70C —
Packaging Tray Tray
Manufacturer Standard Lead Time 16 Weeks (per Mouser, as of 2026-09-02) —
Programmable Type In-System Programmable (ISP) —
Supplier Device Package 256-FBGA —
Number of I/O — 119
工作電源電壓 — 1.5 V
Process Technology — 130 nm, 7-layer metal flash-based CMOS
Configuration Memory — Flash (nonvolatile)
System Performance — Up to 350 MHz
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
封裝 / 外殼 — 256-Ball FBGA (FGG256)
安裝方式 — SMD/SMT
Series — M7AFS600
Live at Power-Up (LAPU) — Yes
RoHS 狀態 — [DATA_NEEDED: RoHS status]
Analog Subsystem — Integrated ADC, voltage/temperature monitors (per Fusion family datasheet)

資料表與資源

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