M7AFS600-FGG256I vs A3PE600-FG256I 比較

詳細並排比較 M7AFS600-FGG256I 由 Microchip Technology 與 A3PE600-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 啟用中
Microchip Technology
A3PE600-FG256I A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip

A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip

A3PE600-FG256I ✓ 啟用中

規格比較

參數 M7AFS600-FGG256I A3PE600-FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion Mixed-Signal FPGA ProASIC3E
System Gates 600K —
User I/O 119 —
封裝 256-LBGA (FBGA), 1 mm ball pitch 256-FBGA (LBGA), 17 x 17 mm, 1.0 mm pitch
Core Voltage 1.5 V —
Process Technology 130 nm —
Maximum System Frequency 1098.9 MHz (per distributor parametric listing) 350 MHz
Embedded Processor ARM CoreMP7 —
Fabric Type Flash-based, non-volatile, instant-on —
Analog Subsystem Integrated configurable analog (per Microchip Fusion family page) —
On-chip Flash Memory Yes (large flash memory blocks, per Microchip Fusion family page) —
Clock Management Integrated clock generation and management circuitry (PLLs) —
Temperature Grade Industrial (I suffix) —
工作溫度範圍 -40C to +85C (industrial grade standard range) —
安裝類型 Surface Mount Surface Mount
Packaging Tray Tray
MSL 等級 [DATA_NEEDED: MSL Level] —
Thermal Resistance (theta_JA) [DATA_NEEDED: Thermal Resistance] —
Logic Gates — 600000
D Flip-Flops (DFFs) — 13824
CLBs / VersaTiles — 13824
Number of User I/O — 165
Core Supply Voltage — 1.425 V to 1.575 V
Technology — 130 nm CMOS flash-based
Configuration Memory — Nonvolatile Flash (single-chip, live at power-up)
工作溫度 — -40C to +100C (TJ), industrial
RoHS 狀態 — RoHS Non-Compliant (contains lead; FGG variant is green)
Lead Free Status — Contains Lead
Speed Grade — Standard (-1)

資料表與資源

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