MC9S08AC16MFDE vs MC9S08AC32CFGE 比較
詳細並排比較 MC9S08AC16MFDE 由 NXP Semiconductors 與 MC9S08AC32CFGE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08AC32CFGE - 8-bit S08 MCU 32KB Flash 40MHz LQFP-44 | NXP
MC9S08AC32CFGE ✓ 啟用中規格比較
| 參數 | MC9S08AC16MFDE | MC9S08AC32CFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Architecture | HCS08 (8-bit) CISC | — |
| Program Memory Type | Flash | Flash |
| Program Memory Size | 16 KB (16K x 8) | — |
| RAM Size | 1 KB | [DATA_NEEDED: RAM size] |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O Pins | 38 | — |
| 工作溫度範圍 | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| 封裝 | QFN-48 (7x7 mm) with Exposed Pad | 44-LQFP (10x10 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| Peripherals | TPM, ADC, SCI, SPI, I2C | — |
| Debug Interface | Background Debug Mode (BDM) | Background Debug Mode (BDM), 6-pin connector |
| RoHS 狀態 | Compliant | RoHS Compliant |
| Lead-Free | Yes | — |
| 生命週期狀態 | Active | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| 最大時脈頻率 | — | 40 MHz |
| Flash Memory Size | — | 32 KB (32K x 8) |
| Number of I/O | — | 38 |
| Product Series | — | S08AC (Flexis series) |
| Life Cycle Stage | — | ACTIVE |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |