MC9S08AW32CFGE vs MC9S08AW16CFGE 比較
詳細並排比較 MC9S08AW32CFGE 由 NXP Semiconductors 與 MC9S08AW16CFGE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08AW16CFGE - S08 8-bit MCU 16KB Flash 40MHz LQFP-44 | NXP
MC9S08AW16CFGE Nrnd規格比較
| 參數 | MC9S08AW32CFGE | MC9S08AW16CFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) |
| Core Size | 8-bit | 8-bit |
| Maximum CPU Frequency | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 32 KB (32K x 8) | 16KB (16K x 8) |
| RAM | 2 KB | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC Resolution | 10-bit | — |
| ADC Channels | 8-channel | — |
| General Purpose I/O | 34 | — |
| 封裝 | 44-LQFP (10x10 mm), 0.5 mm pitch | — |
| Package Standard | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| CPU Speed | — | 40 MHz |
| Architecture | — | CISC, HC08 instruction set with added BGND instruction |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| I/O Ports | — | 38 general-purpose I/O |
| Package Type | — | 44-LQFP (10x10 mm) |
| Package Outline | — | QFNL, MO-220VKKD-2, 0.50 mm pitch, 1 mm height |
| Family | — | S08AW (AW60/AW48/AW32/AW16) |
| Target Industries | — | Industrial and Automotive |
| Lifecycle Status (NXP) | — | NRND (Not Recommended for New Designs) |