MC9S08AW60CFUE vs MC9S08AW32VFUE 比較
詳細並排比較 MC9S08AW60CFUE 由 NXP Semiconductors 與 MC9S08AW32VFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08AW60CFUE | MC9S08AW32VFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Frequency | 40 MHz | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| Core | Enhanced HCS08 8-bit core | HCS08 (S08 CISC) |
| 供應電壓 | 2.7 V to 5.5 V | — |
| Internal Bus Frequency | 20 MHz | — |
| I/O Ports | 38 ports | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| 封裝 | 64-QFP, 14 x 14 mm | 64-QFP (14x14 mm) |
| Package Height | 1 mm | — |
| Package Pitch | 0.50 mm | — |
| 安裝方式 | Surface mount | — |
| Instruction Cycle | 50 ns minimum at 2.7 V and 20 MHz bus | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode interface | Background Debug Mode (BDM) |
| Application Support | Industrial and automotive | — |
| 生命週期狀態 | NRND | — |
| Supplier Reference | NXP USA Inc. | — |
| 資料匯流排寬度 | — | 8-bit |
| 最大時脈頻率 | — | 40 MHz |
| Program Memory Size | — | 32 KB Flash |
| RAM Size | — | 2 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, up to 12 channels |
| Timers | — | TPM1, TPM2 (PWM), RTI, PIT |
| Communication Interfaces | — | 1x SPI, 2x SCI (UART), 1x I2C |
| I/O Pins | — | 54 general-purpose I/O |
| 安裝類型 | — | Surface Mount |
| 工作溫度 | — | -40 C to +105 C |
| RoHS 狀態 | — | Compliant |