MC9S08DV60AMLH vs MC9S08AW32CPUE 比較

詳細並排比較 MC9S08DV60AMLH 由 NXP Semiconductors 與 MC9S08AW32CPUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08DV60AMLH MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP

MC9S08DV60AMLH ✓ 啟用中
NXP Semiconductors
MC9S08AW32CPUE MC9S08AW32CPUE - S08 8-Bit MCU 32KB 40MHz LQFP-64 | NXP

MC9S08AW32CPUE - S08 8-Bit MCU 32KB 40MHz LQFP-64 | NXP

MC9S08AW32CPUE Nrnd

規格比較

參數 MC9S08DV60AMLH MC9S08AW32CPUE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core Processor S08 (HCS08), 8-bit S08
Core Size 8-Bit 8-Bit
Speed 40MHz CPU (20MHz bus) —
Program Memory Size 60KB (60K x 8) —
Program Memory Type FLASH —
RAM Size 3K x 8 —
Number of I/O 53 —
Input-Only Pins 1 —
ADC Resolution 12-bit 10-bit
ADC Channels 16 —
ADC Conversion Time 2.5 us —
Connectivity CAN (MSCAN), LIN master —
Oscillator Type External —
Interrupt/Reset Sources Up to 32 —
供應電壓 3.3V/5V —
封裝 / 外殼 64-LQFP (10x10 mm) —
安裝類型 Surface Mount Surface Mount
Packaging Tray Tray
Instruction Set HC08 with added BGND instruction HC08 with added BGND instruction
Max Clock Speed — 40 MHz
Internal Bus Frequency — 20 MHz
Flash Memory — 32KB (32K x 8)
RAM — 2KB
Supply Voltage Range — 2.7 V to 5.5 V
I/O Count — 38
Debug Interface — Single-wire background debug mode (BDM)
封裝 — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220)
工作溫度 — -40C to +85C
生命週期狀態 — NRND (Not Recommended for New Designs)
Family — S08AW (AW60/48/32/16)

資料表與資源

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