MC9S08DZ60ACLF vs MC9S08DZ60ACLH 比較
詳細並排比較 MC9S08DZ60ACLF 由 NXP Semiconductors 與 MC9S08DZ60ACLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF Nrnd
規格比較
| 參數 | MC9S08DZ60ACLF | MC9S08DZ60ACLH |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core | HCS08 (8-bit CISC) | HCS08 (8-bit CISC) |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| EEPROM / Emulated EEPROM | Available (size [DATA_NEEDED: EEPROM size]) | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Supply Rails | 3.3 V / 5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 24-channel, 12-bit, 2.5 us conversion |
| CAN | 1 x CAN 2.0 A/B | 1 x CAN 2.0A/B |
| LIN | Master LIN 2.0 interface | — |
| Communication Peripherals | SCI (SPI), IIC, MSCAN | — |
| Timer / PWM Channels | Multiple (count [DATA_NEEDED: timer/PWM channel count]) | — |
| LCD Driver | Yes (on-chip segment LCD driver) | — |
| 封裝 | 48-LQFP (7x7 mm) | 64-LQFP (10x10 mm) |
| 工作溫度 | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] | -40 C to +85 C (industrial) |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL 等級 | MSL 3 (per JEDEC J-STD-020) | — |
| RoHS 狀態 | Compliant | Compliant |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| CPU Frequency | — | 40 MHz CPU / 20 MHz bus |
| Flash Size | — | 60 KB (60K x 8) |
| RAM Size | — | 2 KB |
| EEPROM Size | — | 4 KB |
| 資料匯流排寬度 | — | 8 bit |
| 腳位數 | — | 64 |
| 供應電壓 | — | 2.7 V to 5.5 V (3.3 V / 5 V dual) |
| SCI (UART) | — | 2 channels |
| I2C | — | 1 channel |
| SPI | — | 1 channel |
| GPIO | — | 53 I/O pins |
| PWM | — | 6-channel timer/PWM |
| Debug Interface | — | Background Debug Mode (BDM) |