MC9S12DT256MFUE vs MC9S12D64MFUER 比較
詳細並排比較 MC9S12DT256MFUE 由 NXP Semiconductors 與 MC9S12D64MFUER 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ 啟用中NXP Semiconductors
MC9S12D64MFUER - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP (Tape & Reel)
MC9S12D64MFUER Nrnd規格比較
| 參數 | MC9S12DT256MFUE | MC9S12D64MFUER |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | 25 MHz | — |
| Flash Memory | 256 KB (256K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| 資料匯流排寬度 | 16-bit | — |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount (SMD/SMT) |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 2 x 10-bit, 8 channels each (16 ADC channels total) |
| PWM Module | 8-channel 16-bit PWM | — |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| CPU Core | — | S12 CPU V2 |
| Operating Frequency | — | 25 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 64 KB (64K x 8) |
| 封裝 | — | 80-QFP (14 x 14 mm), also called PQFP-80 |
| 供應電壓 | — | 2.5 V / 5 V |
| Number of I/O | — | 59 |
| PWM Channels | — | 8 channels |
| Capture/Compare Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC |
| 工作溫度範圍 | — | -40 C to +125 C |
| Automotive Qualification | — | AEC-Q100 |
| Packaging Method (tray / reel) | — | Tray |
| Approximate Weight | — | 0.033 oz (per supplier catalog) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog / COP | — | Yes (COP reset, watchdog timer) |