MC9S12DT256MPVE vs MC9S12DJ256MPVE 比較
詳細並排比較 MC9S12DT256MPVE 由 NXP Semiconductors 與 MC9S12DJ256MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndNXP Semiconductors
MC9S12DJ256MPVE - HCS12 16-Bit MCU 256KB Flash | NXP | Automotive
MC9S12DJ256MPVE Nrnd規格比較
| 參數 | MC9S12DT256MPVE | MC9S12DJ256MPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz (some sources cite 50 MHz bus) |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | 12 KB |
| EEPROM | 4 KB | 4 KB |
| 資料匯流排寬度 | 16-bit | — |
| 供應電壓 | 2.35 V to 2.75 V (regulated core) | 2.35 V to 2.75 V core; 5 V typical with on-chip regulator |
| I/O Pins | 91 | 59 (some package variants expose 91) |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | Two 8-channel, 10-bit |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| 封裝 | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm), gull-wing |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +125C (automotive grade) | -40C to +125C (automotive AEC-Q100 grade) |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS 狀態 | Compliant | Compliant (lead-free matte-tin finish) |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Bit Width | — | 16-bit |
| Program Flash | — | 256 KB (256K x 8) |
| PWM Channels | — | 8-channel |
| Enhanced Capture Timer | — | 8-channel IC/OC |
| SCI (UART) Modules | — | 2 asynchronous |
| CAN Module | — | 1 x CAN 2.0 (per family datasheet) |
| SPI Module | — | 1 synchronous serial (per family) |
| Moisture Sensitivity Level | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode | — | Yes (BDM) |