MC9S12DT256MPVE vs MC9S12DT256CPVE 比較

詳細並排比較 MC9S12DT256MPVE 由 NXP Semiconductors 與 MC9S12DT256CPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

規格比較

參數 MC9S12DT256MPVE MC9S12DT256CPVE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 256 KB —
RAM 12 KB —
EEPROM 4 KB —
資料匯流排寬度 16-bit 16-bit
供應電壓 2.35 V to 2.75 V (regulated core) 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 2x 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
封裝 112-LQFP (20x20 mm) 112-pin LQFP (20x20 mm)
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +125C (automotive grade) -40C to +85C (industrial, per 'P' suffix family)
Debug Interface Background Debug Mode (BDM) + JTAG BDM (Background Debug Mode)
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status from manufacturer]
生命週期狀態 NRND (Not Recommended for New Designs) —
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
最大時脈頻率 — 25 MHz
Program Memory Size — 256 KB (256K x 8) Flash
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Pins — 91
PWM Channels — 8 channels
Connectivity — CAN, I2C, SCI (UART), SPI
Watchdog — COP (Computer Operating Properly) watchdog

資料表與資源

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