MC9S12XET256CAG vs MC9S12XDT512CAG 比較

詳細並排比較 MC9S12XET256CAG 由 NXP Semiconductors 與 MC9S12XDT512CAG 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12XET256CAG MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MC9S12XET256CAG ✓ 啟用中
NXP Semiconductors
MC9S12XDT512CAG MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDT512CAG Nrnd

規格比較

參數 MC9S12XET256CAG MC9S12XDT512CAG
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core S12X (16-bit CISC) + XGATE co-processor —
CPU Architecture 16-bit HCS12X —
最大時脈頻率 50 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 16 KB —
EEPROM (emulated) 4 KB —
ADC 16-channel, 12-bit —
CAN Modules 4 x CAN 2.0 A/B —
GPIO Up to 119 —
封裝 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
供應電壓 3.13 V to 5.5 V (single 5 V supply with on-chip regulator) 2.35 V to 2.75 V
工作溫度 -40 C to +85 C (CAG grade, see datasheet) [DATA_NEEDED: operating temperature range]
安裝類型 Surface Mount Surface Mount
MSL 等級 3 (per JEDEC J-STD-020) —
RoHS 狀態 Compliant —
Debug Interface BDM (Background Debug Mode) —
Memory Protection Unit Yes (supervisor/user modes) —
Core Processor — HCS12X (CPU12X)
Core Size — 16-bit
Speed — 80 MHz
Program Memory Type — FLASH
Program Memory Size — 512 KB (512K x 8)
I/O Count — 119
Architecture — HCS12X (CISC, upward compatible with HCS12)
Family Series — 9S12X (S12XD)
Technology — CMOS
Target Application — Automotive multiplexing
Life Cycle Stage — ACTIVE (per datasheet listings); NRND per NXP product page
Connectivity — CAN, SCI, SPI, I2C [DATA_NEEDED: exact peripheral count]
ADC Resolution — [DATA_NEEDED: ADC resolution]
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]

資料表與資源

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