MCF5307FT66B vs MCF5307CAI66B 比較

詳細並排比較 MCF5307FT66B 由 NXP Semiconductors 與 MCF5307CAI66B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF5307FT66B MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B Nrnd
NXP Semiconductors
MCF5307CAI66B MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B ⚠ 最後購買機會

規格比較

參數 MCF5307FT66B MCF5307CAI66B
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 最後購買
Core Architecture ColdFire V3 (MCF530x) —
資料匯流排寬度 32-bit 32 bit
最大時脈頻率 66 MHz 66 MHz
Program Memory Type ROMless (external memory required) —
On-chip SRAM 4 KB (4K x 8) 4 KB
Number of I/O Lines 16 —
Oscillator Type External —
封裝 / 外殼 208-BFQFP (28x28 mm) —
安裝類型 Surface Mount Surface Mount
供應電壓 [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet] 3.3 V
工作溫度 [DATA_NEEDED: temperature grade per device marking] -40C to +85C
External Memory Controller Yes (ROM/SRAM/DRAM/Flash) —
DMA Channels [DATA_NEEDED: DMA channel count] —
Timers [DATA_NEEDED: timer module count] —
Serial Interfaces [DATA_NEEDED: UART/SPI/I2C instance count] —
RoHS 狀態 [DATA_NEEDED: per device marking] Compliant
Packaging (distributor) Tray —
Core — ColdFire V3
Performance — 70 MIPS
Instruction Set Architecture — ColdFire (variable-length RISC, 68k-derived)
On-chip ROM — ROMless
封裝 — 208-FQFP (28x28 mm)
MAC Unit — Yes (integrated multiply-accumulate)
DRAM Controller — Yes (integrated)
DMA Controller — Yes
UART — 2
Process Node — 0.35 um
Tray Quantity — Per manufacturer tray standard

資料表與資源

瀏覽所有產品 建立 BOM 索取報價