MPC5554MVR132 vs MPC5554AZP132 比較

詳細並排比較 MPC5554MVR132 由 NXP Semiconductors 與 MPC5554AZP132 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC5554MVR132 MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 - 32-bit Qorivva MCU, 132MHz, 2MB Flash | NXP

MPC5554MVR132 Nrnd

規格比較

參數 MPC5554MVR132 MPC5554AZP132
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Core Architecture Power Architecture e200z6 Power Architecture e200z6
CPU Core 32-bit, single-core —
Maximum Operating Frequency 132 MHz —
Flash Memory Size 2 MB (2M x 8) —
SRAM Size 64 KB —
Instruction Cache / Data Cache 64 KB unified —
封裝 416-ball TE-PBGA (27 x 27 mm, 1 mm pitch) 416-PBGA (TEPBGA-416), 27 x 27 mm
安裝類型 Surface Mount Surface Mount (BGA)
Supply Voltage (Core) [DATA_NEEDED: core voltage range] —
Supply Voltage (I/O) 3.3 V (typical) —
工作溫度範圍 -40 C to +125 C (junction) [DATA_NEEDED: operating temperature range]
CAN Controllers 2 x FlexCAN 2.0B, 64 message buffers each —
ADC Channels Up to 40 channels, 12-bit SAR —
eTPU Channels 64 channels (Enhanced Time Processing Unit) —
DSPI Modules 3 x DSPI (Deserial/Serial Peripheral Interface) —
External Bus Interface 16-bit / 32-bit bus, supports SDRAM, SRAM, Flash up to 16 MB —
MMU / FPU MMU present; FPU (single-precision) per e200z6 core —
RoHS 狀態 Compliant Compliant (lead-free PBGA)
MSL 等級 3 (per JEDEC J-STD-020) —
Core Bit Width — 32-bit
Maximum Core Frequency — 132 MHz
Program Memory (Flash) — 2 MB (2M x 8)
Ball Pitch — 1.0 mm
Lead-Free Status — Lead free (per package marking MS-034AAL-1)
Product Family — Qorivva MPC55xx
Lifecycle Stage — NRND (Not Recommended for New Designs)
Peripheral Integration — FlexCAN, eMIOS, eQADC, DSPI (per datasheet reference manual)
Instruction Set — Power Architecture with VLE extension
供應電壓 — [DATA_NEEDED: supply voltage range]
RAM Size — [DATA_NEEDED: on-chip SRAM size]

資料表與資源

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