MPC8541ECPXALF vs MPC8555EVTAPF 比較

詳細並排比較 MPC8541ECPXALF 由 NXP Semiconductors 與 MPC8555EVTAPF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8541ECPXALF MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF ✓ 啟用中
NXP Semiconductors
MPC8555EVTAPF MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF ⚠ 最後購買機會

規格比較

參數 MPC8541ECPXALF MPC8555EVTAPF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 最後購買
Core Architecture PowerPC e500 (Book-E enhanced) PowerPC e500
Maximum Core Frequency 667 MHz —
資料匯流排寬度 64-bit 32 bit
Instruction Set 32-bit Power Architecture —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB integrated
Core Supply Voltage 1.2 V (typical) —
I/O Supply Voltage 3.3 V —
Ethernet Controllers 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) —
Memory Controller DDR/DDR2 with ECC 32-bit DDR with ECC, up to DDR-333
PCI Express PCIe x1 / x2 —
Security Engine SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) IPSec / SSL / TLS / bulk crypto acceleration
封裝 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) 783-FCPBGA (29 x 29 mm)
工作溫度 -40C to +105C -40C to +105C (industrial extended)
安裝類型 Surface Mount Surface Mount
RoHS Compliance Compliant (lead-free) —
Core Count — 1
最大時脈頻率 — 833 MHz
Series — PowerQUICC III (MPC85xx)
L1 Cache — 32 KB instruction + 32 KB data
Ethernet — 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI)
PCI Interface — 2 x PCI 2.2 (32-bit, 66 MHz)
供應電壓 — 1.0 V core, 3.3 V I/O (typical)
RoHS 狀態 — Compliant
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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