MPC860DECZQ50D4 vs MPC860SRCZQ50D4 比較
詳細並排比較 MPC860DECZQ50D4 由 NXP Semiconductors 與 MPC860SRCZQ50D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860DECZQ50D4 | MPC860SRCZQ50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Core Processor | MPC8xx PowerQUICC, 32-bit Power Architecture | — |
| Number of Cores | 1 | — |
| Bus Width | 32-bit | — |
| Core Speed | 50 MHz | — |
| Co-Processors / DSP | Communications; CPM (Communications Processor Module) | — |
| RAM Controllers | DRAM | — |
| On-Chip Cache | 4 KB instruction + 4 KB data | — |
| MMU | Yes (integrated, with translation tables) | — |
| Ethernet | 2x 10 Mbps MAC (MII) | — |
| Serial Communications Controllers (SCC) | 4 | — |
| Serial Management Controllers (SMC) | 2 | — |
| DMA Channels | 4 | — |
| 供應電壓 | 3.3 V (core 2.2 V, I/O 3.3 V) | 3.3 V |
| 工作溫度 | -40 C to +95 C | — |
| 封裝 | 357-PBGA, 25x25 mm | 357-PBGA (25x25 mm) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Lead Status | Contains Lead | — |
| RoHS 狀態 | Non-Compliant (legacy BGA with lead-bearing solder balls) | RoHS status per datasheet |
| Packaging | Tray (D4 suffix) | Tray |
| Processor Family | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC 32-bit |
| Core Count | — | 1 |
| Operating Frequency | — | 50 MHz |
| Process Technology | — | 0.32 µm CMOS |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Integrated CPM | — | Yes (QUICC engine, multiple SCCs/SMCs) |
| External Bus Width | — | 32-bit |
| Lead Free Status | — | Contains Lead |
| 生命週期狀態 | — | Discontinuance / Last Time Buy per NXP PCN |