MPC870CZT66 vs MPC875CZT66 比較
詳細並排比較 MPC870CZT66 由 NXP Semiconductors 與 MPC875CZT66 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC870CZT66 | MPC875CZT66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 最後購買 |
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) | Power Architecture (32-bit) |
| Core Count | 1 | — |
| 資料匯流排寬度 | 32-bit | — |
| 最大時脈頻率 | 66 MHz | — |
| 供應電壓 | 3.3 V | 3.3 V |
| 工作溫度 | -40C to +100C | -40C to +100C |
| Process Technology | 0.18 um CMOS | — |
| 封裝 | 256-PBGA (23x23 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 安裝方式 | Tray | — |
| Instruction Set | RISC | — |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI | — |
| External Memory Bus | Yes (SDRAM/Flash controller) | — |
| RoHS 狀態 | Compliant | Non-Compliant |
| MSL 等級 | 3 (168 hours) | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit |
| Core Speed | — | 66 MHz |
| 封裝 / 外殼 | — | 256-PBGA (23x23 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Number of Cores | — | 1 |
| Communication Modules | — | FCC, SCC, SMC, I2C, SPI |
| Ethernet Support | — | Dual Fast Ethernet MAC (MPC875 feature) |
| Family | — | PowerQUICC MPC8xx |
| 生命週期狀態 | — | End of Life (per NXP product page) |