MSC8256SVT1000B vs MSC8251SVT1000B 比較

詳細並排比較 MSC8256SVT1000B 由 NXP Semiconductors 與 MSC8251SVT1000B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MSC8256SVT1000B MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B Obsolete
NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete

規格比較

參數 MSC8256SVT1000B MSC8251SVT1000B
品牌 NXP Semiconductors NXP Semiconductors
類別 DSP DSP
生命週期狀態 Obsolete Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Series StarCore MSC8256 —
Type SC3850 Six-Core Digital Signal Processor —
Core Architecture StarCore SC3850 (VLE, 4-issue) SC3850 StarCore, single core
Number of Cores 6 —
Core Clock Speed 1 GHz —
Aggregate Throughput 1000 MIPS per core (6000 MIPS total) —
Data Width 32-bit / 64-bit —
L1 Instruction Cache (per core) 32 KB —
L1 Data Cache (per core) 32 KB —
Unified L2 Cache (per core) 512 KB (configurable to M2 memory in 64 KB increments) —
On-Chip RAM (total) 576 KB —
Non-Volatile Memory (ROM) 96 KB —
MMU Yes (hardware memory management unit) —
EPIC (Interrupt Controller) Yes (Extended Programmable Interrupt Controller) —
Timers (per core) 2 x 32-bit general-purpose —
DDR Memory Controller DDR2/DDR3 with ECC —
High-Speed Interfaces Serial RapidIO, PCI Express, SGMII, RGMII —
Peripheral Interfaces I2C, SPI, UART, GPIO —
Security Engine SEC (cryptographic acceleration) —
封裝 783-FCBGA (29x29 mm) —
工作溫度 -40C to +105C (industrial) [DATA_NEEDED: operating temperature grade]
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Core Revision — StarCore R2.1
Maximum Core Clock — 1 GHz
MIPS — [DATA_NEEDED: MIPS rating for 1 GHz SC3850]
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Unified Cache — 512 KB (configurable, SRAM or MAP)
On-Chip RAM — 576 KB
Internal ROM — 96 KB
TDM Interfaces — 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support
Ethernet MAC — Yes (integrated)
PCI Express — Yes (integrated controller)
Serial RapidIO — Yes (SERDES-based)
DMA Controller — Multi-channel DMA
Package Type — FCBGA (Flip-Chip Ball Grid Array)
Package Pin Count — 783 balls
Package Dimensions — 29 mm x 29 mm
Lead-Free / Halogen-Free — Yes (lead-free, halogen-free package)

資料表與資源

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