OSD3358-512M-BAS-XB vs OSD3358-512M-BAS 比較

詳細並排比較 OSD3358-512M-BAS-XB 由 Octavo Systems 與 OSD3358-512M-BAS 由 Octavo Systems. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Octavo Systems
OSD3358-512M-BAS-XB OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB ✓ 啟用中
Octavo Systems
OSD3358-512M-BAS OSD3358-512M-BAS - AM3358 SiP 1GHz Cortex-A8 512MB DDR3 | Octavo Systems

OSD3358-512M-BAS - AM3358 SiP 1GHz Cortex-A8 512MB DDR3 | Octavo Systems

OSD3358-512M-BAS ✓ 啟用中

規格比較

參數 OSD3358-512M-BAS-XB OSD3358-512M-BAS
品牌 Octavo Systems Octavo Systems
類別 Microcontrollers DSP
生命週期狀態 啟用中 啟用中
Device Type System-In-Package (SiP) —
Integrated Processor TI Sitara AM3358 ARM Cortex-A8 —
Maximum CPU Clock 1 GHz 1 GHz
Graphics Accelerator SGX530 SGX530
Onboard DDR3 SDRAM 512 MB —
Power Management IC TPS65217C (integrated) —
工作溫度範圍 -40 C to +85 C (industrial) —
封裝 400-ball BGA —
安裝類型 Surface Mount Surface Mount (BGA)
PRU-ICSS Subsystems 2 (industrial-grade) —
Ethernet 10/100/1000 Mbps (Gigabit) 2x 10/100/1000 MAC (external PHY required)
USB USB 2.0 High-Speed PHY —
CAN 2x CAN 2.0B —
SPI 2x SPI —
I2C 3x I2C —
RoHS 狀態 Compliant Compliant
Processor Core — Texas Instruments AM3358 ARM Cortex-A8
SIMD Engine — NEON SIMD
On-package DRAM — 512 MB DDR3
On-package PMIC — TPS65217C integrated
Package Type — 400-ball BGA
Package Size — 20 mm x 20 mm (BGA), 1 mm pitch
Pin Compatibility — Superset of TI AM3358 ZCZ 18x18 BGA
USB Ports — 2x USB 2.0 (host), 1x USB 2.0 (client/OTG)
Industrial Communication — 2x PRU-ICSS
工作溫度 — -40C to +85C (industrial)
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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