P1013NXE2LFB vs P1022NXN2LFB 比較

詳細並排比較 P1013NXE2LFB 由 NXP Semiconductors 與 P1022NXN2LFB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
P1013NXE2LFB P1013NXE2LFB - 1.067GHz e500v2 QorIQ MPU | NXP | Networking SoC

P1013NXE2LFB - 1.067GHz e500v2 QorIQ MPU | NXP | Networking SoC

P1013NXE2LFB ✗ 停產
NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ 最後購買機會

規格比較

參數 P1013NXE2LFB P1022NXN2LFB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 停產終止 最後購買
Core Architecture PowerPC e500v2 —
Number of Cores 1 —
資料匯流排寬度 32-bit —
Maximum Core Frequency 1.067 GHz —
L1 Cache (Instruction + Data) 16 KB + 16 KB —
L2 Cache 256 KB —
Memory Controller DDR2/DDR3 with ECC, 32-bit DDR2/DDR3 with ECC support, up to 32-bit
Ethernet MACs 3 x 10/100/1000 (one supports 2.5G SGMII) 3 x 10/100/1000 Mbps Gigabit
PCI Express 4 controllers (x4/x2/x1 configurable) —
USB 2 x USB 2.0 (with integrated PHY) USB 2.0 host/device
Security Engine SEC with IPSec, RNG, tamper detection Integrated (symmetric/asymmetric crypto acceleration)
LCD Controller Yes, up to 1280 x 1024 —
CAN FlexCAN 2.0 (2 channels) —
工作溫度 -40C to +125C -40 °C to +125 °C (industrial)
封裝 689-TEPBGA II (31x31 mm) —
安裝類型 Surface Mount (BGA) Surface Mount (BGA, requires thermal via array under die)
RoHS 狀態 Compliant —
Temperature Grade Automotive / Industrial —
Architecture — Power Architecture e500 dual-core (RISC, 32-bit)
Clock Speed (Core) — 1.067 GHz
Platform Version — 1067/533/667 ET NE r1.1
Core Count — 2
Package Type — TEPBGA-689 (Plastic, halogen-free, RoHS-compliant)
Package Dimensions — 31 x 31 mm, 2.23 mm height
腳位數 — 689
供應電壓 — 3.13 V to 3.47 V
PCIe Interfaces — 3 x PCIe Gen1
Display Controller — 32-bit LCD controller
RoHS Compliance — Yes (halogen-free)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價