P1013NXE2LFB - 1.067GHz e500v2 QorIQ MPU | NXP | Networking SoC
MPN： P1013NXE2LFB ✗ 停產P1013NXE2LFB 概覽
What is an MPU SoC? An MPU (Microprocessor Unit) System-on-Chip integrates a CPU core, memory controllers, and a wide range of peripherals (Ethernet, PCIe, USB, security blocks) onto a single die. Within the NXP QorIQ P1 family it sits in the hierarchical chain: e500v2 core -> PowerPC core -> Power Architecture MPU -> communications processor -> embedded SoC. This level of integration reduces board area, BOM cost, and design complexity for routers, switches, and industrial gateways that previously required a CPU plus a multi-chip peripheral set.
Key features include hardware-accelerated IPSec/SEC, a 32-bit DDR2/DDR3 controller with ECC, integrated LCD display controller up to 1280x1024, four PCI Express lanes, three Gigabit Ethernet MACs (one configurable as 2.5G), FlexCAN 2.0, dual USB 2.0 with PHY, and a True Hardware Random Number Generator. Industrial peripherals include two I2C, two UART, two SPI, and an SD/MMC interface.
The P1013NXE2LFB uses the e500v2 superscalar core with dual integer and dual floating-point (single-precision) units, BTB and 16 KB/16 KB instruction/data L1 caches, and a 256 KB backend L2. The platform integrates a high-bandwidth interconnect plus dedicated DMA channels to sustain throughput on Ethernet and PCIe paths while keeping interrupt latency bounded. According to the NXP product page, the device is marked End of Life and is targeted for replacement by the Layerscape LS1021A family.
Typical applications include industrial routers, factory-floor gateways, networked HMI panels, single-board computers, secure access points, CAN-bridge automation controllers, and SMB network attached storage. Its wide -40C to +125C temperature range and integrated peripherals make it suited for harsh-environment networking equipment and automotive telematics ECUs.
Designers should plan for a multi-layer PCB with controlled-impedance DDR3 routing, a 5 mm keep-out around the 31x31 mm BGA, and bulk decoupling sized for the simultaneous switching of PCIe and SerDes I/O. For new designs, evaluate the Layerscape LS1021A as the recommended drop-in successor.
This page synthesizes distributor stock, lifecycle status, pin-compatible QorIQ alternatives, and practical board-design notes that supplement the manufacturer datasheet and the NXP end-of-life notice.
直接替換替代品，適用於 P1013NXE2LFB — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： P1013NXE2LFB （相同外形與佔位） — 差異在於 Ethernet MACs, Memory Controller, Mounting Type, Operating Temperature, Security Engine.
P1022NXN2LFB
✅ 直接替換聯絡詢價
查看資料表 →P1013NSN2KFB
✅ 直接替換📋 參考替代品（不在目錄中）
P1022NSN2KFB
✅ 直接替換📋 參考替代品（不在目錄中）
P1014NXE2LFB
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
P1012NXE2LFB
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
P2020NSN2KFB
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
P1013NXE2LFB 最大額定值與電氣特性
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| 資料匯流排寬度 | 32-bit |
| Maximum Core Frequency | 1.067 GHz |
| L1 Cache (Instruction + Data) | 16 KB + 16 KB |
| L2 Cache | 256 KB |
| Memory Controller | DDR2/DDR3 with ECC, 32-bit |
| Ethernet MACs | 3 x 10/100/1000 (one supports 2.5G SGMII) |
| PCI Express | 4 controllers (x4/x2/x1 configurable) |
| USB | 2 x USB 2.0 (with integrated PHY) |
| Security Engine | SEC with IPSec, RNG, tamper detection |
| LCD Controller | Yes, up to 1280 x 1024 |
| CAN | FlexCAN 2.0 (2 channels) |
| 工作溫度 | -40C to +125C |
| 封裝 | 689-TEPBGA II (31x31 mm) |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Temperature Grade | Automotive / Industrial |
P1013NXE2LFB 689-tepbga ii (31x31 mm) 腳位配置指南
P1013NXE2LFB（689-tepbga ii (31x31 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： P1013NXE2LFB.
請參閱 資料表 以查看完整腳位配置。
典型應用
P1013NXE2LFB 適用於 7 應用s: Industrial Router, Factory-Floor Gateway with CAN, Networked HMI / Panel PC, Secure VPN Access Point, Automotive Telematics ECU, Industrial Edge SBC, Smart-Energy Substation Controller.
Industrial Router
The NXP P1013NXE2LFB fits industrial routers because it integrates three 10/100/1000 Ethernet MACs (one configurable as 2.5G SGMII) directly with four PCI Express controllers and the SEC hardware crypto engine. At 1.067 GHz the e500v2 core provides deterministic throughput for route-table lookups and IPSec offload, while the DDR2/DDR3 controller with ECC supports the memory bandwidth needed by line-rate packet classification. Placed on the main SoC board alongside a 4 Gb DDR3 and a small PHY, the part removes the need for an external CPU companion. Compared with FPGA-accelerated routers the P1013NXE2LFB cuts BOM by an estimated 25-35% at similar packet-per-second rates.
推薦
Factory-Floor Gateway with CAN
The P1013NXE2LFB adds native FlexCAN 2.0 (2 channels) plus GPIO, SPI, I2C, and UART for use as a factory-floor gateway. Its -40C to +125C operating range suits vibration-prone, thermally harsh enclosures. A real installation pairs this MPU with a CAN transceiver such as the NXP TJA1057 on the HS lines, while the on-chip Ethernet moves aggregated traffic to the plant network. The P1013's SEC engine can sign sensor data at the edge without an external TPM, reducing exposure of unencrypted CAN frames on the factory LAN.
推薦
Networked HMI / Panel PC
The P1013NXE2LFB's integrated LCD controller supports displays up to 1280x1024, allowing a single-chip HMI without a companion GPU. Combined with three Ethernet MACs it can drive a multi-protocol panel PC front-end - Modbus TCP on one port, EtherNet/IP on another, and a management link on the third. The DDR3 controller sustains video frame-buffer bandwidth, while GPIO and SPI handle backlight, touch sensing, and keypad interfaces. Industrial users benefit from the wide -40C to +125C temperature range across weld-shop and outdoor deployments.
推薦
Secure VPN Access Point
The P1013NXE2LFB integrates an SEC engine with IPSec protocol offload, an onboard True Hardware Random Number Generator, and tamper-detection interfaces - critical for secure access points. At 1.067 GHz it can sustain over 200 Mbps AES-SHA1 IPsec throughput while still serving control-plane and routing functions. Three Gigabit Ethernet MACs allow split LAN/WAN/DMZ ports, while two USB 2.0 ports accommodate secure-boot mass storage or an external smart-card reader for two-factor authentication.
推薦
Automotive Telematics ECU
The P1013NXE2LFB was specifically designed for automotive/industrial use with operation from -40C to +125C. Its two FlexCAN interfaces connect directly to vehicle CAN and CAN-FD networks, while three Gigabit Ethernet MACs serve newer in-vehicle networks and cellular backhaul. The SEC engine with RNG and tamper detection handles trusted boot and key storage, important for connected-car ECUs. Designers should confirm software support for AUTOSAR or target RTOS, and follow JEDEC-based automotive qualification reports.
推薦
Industrial Edge SBC
The P1013NXE2LFB integrates Ethernet, PCI Express, USB 2.0, SATA, GPIO, and dual CAN onto a single die - making it an ideal core for compact industrial single-board computers. A 4-layer PCB can host the SoC plus a single DDR3 SODIMM slot, mPCIe, and dual Ethernet jacks. At 1.067 GHz the part runs lightweight Linux distributions such as Yocto and Buildroot, suitable for edge data-collection nodes in machine-vision or remote-monitoring plants. The 31x31 mm BGA package, however, requires controlled-impedance stack-up and aggressive thermal relief.
推薦
Smart-Energy Substation Controller
The P1013NXE2LFB's combined triple-Ethernet, dual-CAN, and SEC hardware engine make it a strong candidate for IEC 61850 substation controllers. The e500v2 core runs the necessary networking protocols at deterministic timing, the DDR3 controller supports complex IEC 104 and 103 stack buffers, and the SEC engine secures GOOSE messages. Designers must still perform IEC 61850 conformance testing and adhere to substation electromagnetic compliance (IEC 61000-4) standards - confirm specific protocol support with your NXP FAE before committing.
推薦
推薦產品摘要
工程參考資料，適用於 P1013NXE2LFB — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | P1022NXN2LFB | P1013NSN2KFB | P1022NSN2KFB | P1014NXE2LFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Number of Cores | 1 e500v2 | 2 e500v2 | 1 e500v2 | 2 e500v2 | 1 e500v2 |
| Maximum Core Frequency | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.067 GHz | 1.0 GHz |
| L2 Cache | 256 KB | 512 KB (dual-core shared) | 256 KB | 512 KB (dual-core shared) | 256 KB |
| DDR2/DDR3 Controller | 32-bit with ECC | 32-bit with ECC | 32-bit with ECC | 32-bit with ECC | 32-bit with ECC |
| Ethernet MACs | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) | 3 x 10/100/1000 (one supports 2.5G) |
| PCI Express | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) | 4 controllers (x1/x2/x4) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Approx Unit Price (qty 1, USD) | 185.00 | ~250.00 | ~165.00 | ~260.00 | ~190.00 |
主要差異化特點
- Single e500v2 core for power-constrained designs (對比P1022NXN2LFB)
- Triple Gigabit Ethernet with 2.5G-capable SGMII on one port (對比P1014NXE2LFB)
- Wide industrial temperature range with automotive qualification (對比P1013NSN2KFB)
設計說明
The 689-ball TEPBGA II (31x31 mm) demands a 6-layer minimum PCB stack-up with 0.5 mm-pitch BGA escape routes on the top two layers and a continuous ground plane on layer 2. Per Freescale/NXP layout guidelines for QorIQ P1/P2, allocate four PCB layers for the DDR3 byte lanes with matched-length tolerances of +/-25 mils. Maintain a 5 mm keep-out beneath the SoC for thermal vias - a 0.2 mm pitch staggered via array filled with conductive epoxy reduces junction-to-case theta_JA by an estimated 30% compared to a bare BGA footprint.
Estimated: at maximum junction temperature +125C with 1.5 W typical power dissipation, the on-board thermal solution must keep the case below +95C in a still-air industrial enclosure. A thermal compound pad plus 30 x 30 x 10 mm copper spreader or a low-profile clip-on heatsink is recommended for -40C to +85C ambient. Verify your thermal profile with the QorIQ P1022 thermal model document.
Pin compatibility is OS-dependent. Migrating from P1013NXE2LFB to the dual-core P1022NXN2LFB requires recompiling for SMP (use SMP-enabled Linux or vxWorks). Do not assume board-level drop-in implies software-drop-in. Confirm the BOOT configuration block against the Alternate Configurable Reset Configuration Word (ACRCW) header for each substitution.
Use the NXP VRM reference design with a 4-phase buck for VCORE and a 3 A LDO for the DDR3 termination rail. The IO supply (1.8/2.5/3.3 V) must ramp within 100 ms of the VCORE supply or the part powers down into a non-deterministic state. Add a 10 uF + 1 uF + 100 nF decoupling pyramid within a 5 mm radius of the BGA.
合規資訊
RoHS and lead-free confirmed via distributor listings (DigiKey, Mouser, Arrow). AEC-Q100 status not explicitly stated in the verified web data; the part is marketed for automotive/industrial thermal range but designers should confirm automotive qualification directly with NXP FAE before use in automotive safety-critical applications.
