P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
MPN： P1022NXN2LFB ⚠ 最後購買機會P1022NXN2LFB 概覽
A QorIQ processor is a system-on-chip (SoC) family within NXP's communications-platform portfolio, positioning it above discrete microcontrollers and below enterprise-class multi-core CPUs in the taxonomy: SoC -> communications processor -> QorIQ platform -> Power Architecture implementation. QorIQ parts are engineered specifically for high-throughput packet processing, secure networking, and intelligent edge gateways. The P1022 family sits in the value-tier of QorIQ, balancing dual-core performance with the integration of network and storage peripherals.
Key features of the P1022NXN2LFB include 1067/533/667 ET NE r1.1 platform versioning, dual e500 cores with hardware MMU and 36-bit physical addressing, DDR2/DDR3 memory controller supporting up to 32-bit ECC, three 10/100/1000 Ethernet MACs, three PCIe Gen1 interfaces, USB 2.0 host/device, four TDM/I2S interfaces, and a 32-bit LCD controller. The integrated security engine supports symmetric and asymmetric crypto acceleration. Hardware virtualization is provided through the embedded hypervisor extensions.
The P1022NXN2LFB is built on a 45 nm low-power process, with voltage rails between 3.13 V and 3.47 V at the core supply domain. The architecture combines a 256 KB shared L2 cache per core with a platform cache fabric, yielding determinism for control-plane workloads. Compared to the smaller P1013 (single-core), the P1022 adds a second e500 core for symmetric multiprocessing workloads, and compared to the P1020 the P1022 offers higher DDR frequency support.
Typical applications include industrial routers and gateways, factory-floor protocol converters, smart-grid concentrators, multi-service access equipment, line cards for branch routers, military/aerospace networking, networked printers, and edge-of-network media gateways. Its extended temperature range and RoHS/halogen-free TEPBGA package make it suited to long-life industrial designs. When designing with this part, ensure the PCB supports the large 31 x 31 mm BGA land pattern, plan thermal vias under the exposed die area, and validate DDR3/DDR2 IBIS-AMI models for SI compliance on multi-rank memory subsystems.
直接替換替代品，適用於 P1022NXN2LFB — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： P1022NXN2LFB （相同外形與佔位） — 差異在於 Operating Temperature, USB, Memory Controller, PCI Express, Security Engine.
P1022NXN2HFB
✅ 直接替換聯絡詢價
查看資料表 →P1022NSE2HFB
✅ 直接替換聯絡詢價
查看資料表 →P1021NXE2HFB
✅ 直接替換聯絡詢價
查看資料表 →P1020NSE2HFB
✅ 直接替換📋 參考替代品（不在目錄中）
P1013NSE2LFB
✅ 直接替換聯絡詢價
查看資料表 →P1022NXN2LFB 最大額定值與電氣特性
| Architecture | Power Architecture e500 dual-core (RISC, 32-bit) |
| Clock Speed (Core) | 1.067 GHz |
| Platform Version | 1067/533/667 ET NE r1.1 |
| Core Count | 2 |
| Package Type | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) |
| Package Dimensions | 31 x 31 mm, 2.23 mm height |
| 腳位數 | 689 |
| 工作溫度 | -40 °C to +125 °C (industrial) |
| 供應電壓 | 3.13 V to 3.47 V |
| Memory Controller | DDR2/DDR3 with ECC support, up to 32-bit |
| Ethernet MACs | 3 x 10/100/1000 Mbps Gigabit |
| PCIe Interfaces | 3 x PCIe Gen1 |
| USB | USB 2.0 host/device |
| Display Controller | 32-bit LCD controller |
| Security Engine | Integrated (symmetric/asymmetric crypto acceleration) |
| RoHS Compliance | Yes (halogen-free) |
| 安裝類型 | Surface Mount (BGA, requires thermal via array under die) |
P1022NXN2LFB 31 x 31 mm, 2.23 mm height 腳位配置指南
P1022NXN2LFB（31 x 31 mm, 2.23 mm height 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： P1022NXN2LFB.
請參閱 資料表 以查看完整腳位配置。
典型應用
P1022NXN2LFB 適用於 7 應用s: Industrial Router / Branch Gateway, Smart-Grid Concentrator / Substation Gateway, Factory Floor Protocol Converter, Multi-Service Access Equipment / Line Card, Networked Printer / Multi-Function Peripheral Controller, Edge-of-Network Media Gateway, Avionics / Military Networking Subsystem.
Industrial Router / Branch Gateway
The P1022NXN2LFB is well-matched to industrial routers because its dual 1.067 GHz e500 cores can split the control plane (routing protocols, IPSec) from the data plane (packet forwarding, QoS). The three integrated Gigabit Ethernet MACs supply enough interfaces for WAN, LAN, and DMZ ports without an external switch, while the DDR3-with-ECC controller protects routing tables against soft errors in industrial environments. The 689-ball TEPBGA and 3.13 V – 3.47 V supply simplify power-tree design, and the -40 °C to +125 °C temperature range supports outdoor cabinet deployments.
推薦
Smart-Grid Concentrator / Substation Gateway
Substation automation gateways benefit from the P1022NXN2LFB's industrial temperature rating, deterministic dual-core performance, and integrated security engine for IEC 62351 compliance. The third PCIe lane can host a hardware crypto accelerator or cellular modem, while DDR3-with-ECC keeps buffered fault records intact through single-bit upsets common in high-voltage switchgear environments. The package's halogen-free, RoHS construction meets substation equipment environmental specifications, and the three GbE MACs allow daisy-chained IEC 61850 networks.
推薦
Factory Floor Protocol Converter
The P1022NXN2LFB's mix of Ethernet MACs, USB 2.0, PCIe, and TDM/I2S interfaces matches the requirements of protocol-conversion gateways that bridge Profinet, EtherCAT, Modbus TCP, and legacy serial fieldbus. Dual-core processing lets one core run the deterministic real-time protocol stack while the other executes management-plane HTTP/SNMP agents without jitter-induced latency. The 32-bit LCD controller drives diagnostic panels common on shop-floor HMIs, and the extended -40 °C to +125 °C temperature window supports installation in control cabinets next to variable-frequency drives.
推薦
Multi-Service Access Equipment / Line Card
Service-provider line cards that combine voice (TDM/I2S), data (Gigabit Ethernet), and video (PCIe-attached DSP or FPGA) benefit from the P1022NXN2LFB's peripheral integration, which eliminates several external bridges. The DDR3 controller feeds the line-rate packet buffer while the hardware crypto engine accelerates IPsec and MACsec. Hardware virtualization extensions permit carrier-grade partition between control and forwarding, and the 689-ball TEPBGA with proper thermal via arrays fits the typical ATCA/AMC line-card envelope.
推薦
Networked Printer / Multi-Function Peripheral Controller
Office MFPs and production printers use the P1022NXN2LFB to run page-description-language interpreters (PostScript, PCL) on one e500 core while the second core drives the LCD UI, scan pipeline, and Gigabit Ethernet network stack. The 32-bit LCD controller directly drives the operator panel, USB 2.0 supports host-side printing and mass-storage services, and the PCIe Gen1 lanes attach to optional scanner or fax modems. The 689-ball TEPBGA provides the thermal mass needed for unattended, fanless operation.
推薦
Edge-of-Network Media Gateway
Edge media gateways that bridge TDM, VoIP, and IP video benefit from the P1022NXN2LFB's TDM/I2S interfaces, hardware security engine, and dual GbE MACs. One core can run an RTOS for media-codec processing while the other handles signalling stacks such as SIP. The extended temperature window enables outdoor enclosure mounting, and the integrated security engine accelerates SRTP and DTLS without offloading to a co-processor. PCIe gives headroom to add hardware video transcoding when the application grows.
推薦
Avionics / Military Networking Subsystem
Avionics and military-grade networking equipment can use the P1022NXN2LFB as a rugged industrial networking compute node, leveraging the -40 °C to +125 °C range, the deterministic dual-core architecture, and the ECC-protected DDR3 subsystem. The hardware crypto engine accelerates Type-1-style encryption algorithms, and the three GbE MACs align with standard ARINC 664 / FACE architectures. When designing for avionics, follow DO-254/DO-178C processes to qualify firmware and confirm thermal margins via the TEPBGA's full-cavity thermal-via array.
推薦
推薦產品摘要
工程參考資料，適用於 P1022NXN2LFB — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | P1022NXN2HFB | P1022NSE2HFB | P1021NXE2HFB | P1020NSE2HFB | P1013NSE2LFB |
|---|---|---|---|---|---|---|
| Package | TEPBGA-689 (31 x 31 mm) | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Architecture | Dual e500 (Power Architecture 32-bit) | Dual e500 (Power Architecture 32-bit) | Dual e500 (Power Architecture 32-bit) | Single e500 (Power Architecture 32-bit) | Dual e500 (Power Architecture 32-bit) | Single e500 (Power Architecture 32-bit) |
| Core Count | 2 | 2 | 2 | 1 | 2 | 1 |
| Memory Controller | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) |
| Ethernet MACs | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 |
| PCIe Interfaces | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +105 °C | -40 °C to +125 °C | -40 °C to +105 °C |
| Lifecycle Status (2026-10-09) | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy |
主要差異化特點
- Only dual-core QorIQ P10xx at 1.067 GHz with the NXL/L extension code (對比P1022NXN2HFB)
- Dual-core headroom for split control/data planes (對比P1021NXE2HFB)
- Higher DDR3 frequency ceiling than P1020 (對比P1020NSE2HFB)
設計說明
The 689-ball TEPBGA package exposes the die through the bottom thermal pad. Estimated: at the worst-case core clock of 1.067 GHz and 3.3 V VDD, designers should simulate junction temperature for fanless and fan-cooled enclosures using the NXP-published theta-JB and theta-JC values. Populate a full-cavity thermal via array on all inner PCB layers directly beneath the package thermal pad and stitch the top copper pour with multiple vias to spread heat laterally.
Use a high-density interconnect (HDI) stack-up with micro-vias for fanout from the 31 x 31 mm BGA. Match DDR3 trace lengths within ±25 mil and add SI-grade termination to maintain signal integrity at 533–800 MHz data rates. Keep analog and digital ground returns separate until they meet at a single point under the SoC's GND ball grid to minimize switching-current noise.
Do not assume any QorIQ P-series variants share pinout just because they have the same package code - confirm the specific device's ball-map revision with the NXP reference manual. The 'ET NE' or 'ES' speed codes change the maximum core clock, DDR3 frequency, and thermal envelopes, so a wrong speed grade can cause marginal timing failures only seen at temperature corners.
The P1022NXN2LFB draws substantially different current between the core (Vdd_core), platform (Vdd_platform), and DDR I/O (GVDD) rails. Estimated at idle the platform current may be 1-2 A; full-load 1.067 GHz operation requires substantial decoupling. Place 10 µF X7R bulk plus 0.1 µF + 0.01 µF high-frequency ceramics on every regulator output, and use a controller such as LTC3633AIUFD for the core rail.
合規資訊
Per the digchip summary, the P1022NXN2LFB is halogen-free, RoHS-compliant, plastic TEBGA-689. AEC-Q100 is not applicable for industrial-grade networking SoCs; consult NXP for any automotive compliance data.
