TJA1022HGZ vs TJA1024HG 比較
詳細並排比較 TJA1022HGZ 由 NXP Semiconductors 與 TJA1024HG 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
TJA1022HGZ - Dual LIN 2.2A/SAE J2602 Transceiver DHVQFN-24 | NXP
TJA1022HGZ ✓ 啟用中規格比較
| 參數 | TJA1022HGZ | TJA1024HG |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Interface ICs | Interface ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 功能 | Dual LIN 2.2A / SAE J2602 transceiver | Quad LIN 2.2A/SAE J2602 transceiver |
| Number of Channels | 2 (dual independent LIN physical layer) | — |
| Protocol | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 | — |
| Maximum Data Rate | 20 kBd | — |
| Supply Voltage (VBAT) | 5 V to 27 V (load-dump tolerant to 40 V) | 5 V to 27 V (load-dump tolerant to 40 V) |
| Logic Supply (VCC) | 3.3 V or 5 V integrated LDO | — |
| 工作溫度 | -40 C to +125 C | -40 C to +125 C |
| 封裝 | DHVQFN-24 (5.5 x 3.5 mm) with exposed pad | DHVQFN-24 (SOT815-1), 3.5 x 5.5 mm |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL (Moisture Sensitivity Level) | 1 | — |
| Peak Reflow Temperature | 260 C (max 30 s) | — |
| Terminal Finish | Nickel-Palladium-Gold-Silver (NiPdAuAg) | — |
| JEDEC J-Standard | JESD-609 code e4 | — |
| Automotive Qualification | AEC-Q100 (intended for in-vehicle sub-networks) | — |
| RoHS / REACH | RoHS compliant per NXP product page | — |
| Number of LIN Channels | — | 4 (two independent dual-LIN transceivers) |
| 資料速率 | — | Up to 20 kBd |
| LIN Compliance | — | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 |
| LIN Bus Peak Current | — | 2.2 A |
| Sleep Mode Current | — | < 10 uA (typical per dual channel) |
| ESD (LIN pin, HBM) | — | [DATA_NEEDED: HBM ESD value V] |
| AEC-Q100 | — | Qualified |
| RoHS 狀態 | — | Compliant |
| Software Compatibility | — | TJA1022, TJA1027, TJA1029 |
| 腳位數 | — | 24 |