XA7S25-1CSGA324I vs XC7S50-1CSGA324C 比較
詳細並排比較 XA7S25-1CSGA324I 由 AMD 與 XC7S50-1CSGA324C 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | XA7S25-1CSGA324I | XC7S50-1CSGA324C |
|---|---|---|
| 品牌 | AMD | AMD |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Logic Cells | 23360 | 52,160 |
| Adaptive Logic Modules (ALMs) | 3650 | — |
| Block RAM | 1.58 Mbit | — |
| Number of I/O | 150 | — |
| Core Voltage | 0.95 V to 1.05 V | — |
| 工作溫度範圍 | -40°C to +100°C | — |
| Package Type | 324-LFBGA, CSPBGA (CSGA-324) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 濕度敏感等級 (MSL) | 3 | — |
| Peak Reflow Temperature | 260°C | — |
| Maximum Time at Peak Reflow Temperature | 30 s | — |
| AEC-Q100 Qualification | Qualified | — |
| RoHS 狀態 | Compliant | Compliant |
| Speed Grade | -1 | -1 |
| Configuration Interfaces | JTAG, SPI, BPI | — |
| Family | — | Spartan-7 |
| Block RAM (bits) | — | 2,764,800 |
| DSP Slices | — | 90 |
| User I/O Pins | — | 210 |
| Process Technology | — | 28nm HKMG |
| Core Voltage (VCCINT) | — | 1.0 V |
| 封裝 | — | CSBGA-324 (CSPBGA), 15x15 mm |
| 工作溫度 | — | 0C to +85C (commercial) |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Clock Management Tiles (CMTs) | — | 4 |