XC6SLX25-3FGG484I vs XC6SLX25-3FG484C 比較

詳細並排比較 XC6SLX25-3FGG484I 由 AMD 與 XC6SLX25-3FG484C 由 Advanced Micro Devices, Inc.. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

AMD
XC6SLX25-3FGG484I XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I ✓ 啟用中
Advanced Micro Devices, Inc.
XC6SLX25-3FG484C XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

XC6SLX25-3FG484C ✓ 啟用中

規格比較

參數 XC6SLX25-3FGG484I XC6SLX25-3FG484C
品牌 AMD Advanced Micro Devices, Inc.
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Spartan-6 LX —
Logic Cells 24051 24,051 cells
Configurable Logic Blocks (CLBs) 1879 —
Total RAM Bits 958464 —
Number of I/O 266 —
封裝 484-BBGA (23x23 mm) 484-BBGA, 15 x 15 mm, 0.80 mm pitch
安裝類型 Surface Mount Surface Mount
工作電源電壓 1.14 V ~ 1.26 V —
工作溫度範圍 -40°C ~ 100°C (TJ) —
Speed Grade -3 (highest performance) -3
Internal Frequency 500 MHz 500 MHz
Process Technology 45nm CMOS 45 nm CMOS
RoHS 狀態 Compliant Compliant
Lead Free Yes —
Number of LABs/CLBs 1879 —
Device Type — FPGA
FPGA Family — Spartan-6 LX
Configurable Logic Blocks — 1,879 CLBs
Core Supply Voltage — 1.2 V
工作溫度 — 0 °C to 85 °C
Package Classification — Lead-free CSBGA-324
Metal Balls — 266 balls
Package Reference — MO-275

資料表與資源

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