XC6SLX25-3FGG484I vs XC6SLX25-3FG484C 对比

详细并排对比 XC6SLX25-3FGG484I 出自 AMD 和 XC6SLX25-3FG484C 出自 Advanced Micro Devices, Inc.。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX25-3FGG484I XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD

XC6SLX25-3FGG484I ✓ 量产中
Advanced Micro Devices, Inc.
XC6SLX25-3FG484C XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx

XC6SLX25-3FG484C ✓ 量产中

规格对比

参数 XC6SLX25-3FGG484I XC6SLX25-3FG484C
品牌 AMD Advanced Micro Devices, Inc.
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Spartan-6 LX —
Logic Cells 24051 24,051 cells
Configurable Logic Blocks (CLBs) 1879 —
Total RAM Bits 958464 —
Number of I/O 266 —
封装 484-BBGA (23x23 mm) 484-BBGA, 15 x 15 mm, 0.80 mm pitch
安装类型 Surface Mount Surface Mount
工作电源电压 1.14 V ~ 1.26 V —
工作温度范围 -40°C ~ 100°C (TJ) —
Speed Grade -3 (highest performance) -3
Internal Frequency 500 MHz 500 MHz
Process Technology 45nm CMOS 45 nm CMOS
RoHS 状态 Compliant Compliant
Lead Free Yes —
Number of LABs/CLBs 1879 —
Device Type — FPGA
FPGA Family — Spartan-6 LX
Configurable Logic Blocks — 1,879 CLBs
Core Supply Voltage — 1.2 V
工作温度 — 0 °C to 85 °C
Package Classification — Lead-free CSBGA-324
Metal Balls — 266 balls
Package Reference — MO-275

数据手册与资源

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