XC6SLX75-2FG676I vs XC6SLX75-2FGG676I 比較

詳細並排比較 XC6SLX75-2FG676I 由 AMD 與 XC6SLX75-2FGG676I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

AMD
XC6SLX75-2FGG676I XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I ✓ 啟用中

規格比較

參數 XC6SLX75-2FG676I XC6SLX75-2FGG676I
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Unknown 啟用中
Device Type FPGA Spartan-6 LX field-programmable gate array (FPGA)
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Stated Internal Frequency 667 MHz —
Maximum Inputs or Outputs 400 I/O —
封裝 676-BGA —
Reported Package Dimensions 23 mm x 23 mm —
Reported Package Pitch 1 mm —
Temperature Designation I (industrial) —
工作溫度 0 C to 85 C; conflicting source also reports -40 C to 100 C -40°C to +100°C
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Programmable Architecture Field-configurable digital logic —
安裝類型 Surface mount Surface mount
Manufacturer AMD / Xilinx —
RoHS 狀態 unknown —
REACH Status unknown —
AEC-Q100 Status unknown —
Internal Frequency — 667 MHz
Input/Output Count — 408 I/O
供應電壓 — 1 V
Speed Grade — -2
Process Technology — 45 nm CMOS
Package Type — 676-ball FBGA
Package Dimensions — 27 mm × 27 mm
Ball Pitch — 1 mm
Lead-Free Status — Lead free
Device Family — Spartan-6 LX
FPGA Configuration — [DATA_NEEDED: FPGA configuration interface and supported configuration modes]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP slice count]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

資料表與資源

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