XC6SLX75-2FG676I vs XC6SLX75-2FGG676I 对比

详细并排对比 XC6SLX75-2FG676I 出自 AMD 和 XC6SLX75-2FGG676I 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

AMD
XC6SLX75-2FGG676I XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I ✓ 量产中

规格对比

参数 XC6SLX75-2FG676I XC6SLX75-2FGG676I
品牌 AMD AMD
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Unknown 有效
Device Type FPGA Spartan-6 LX field-programmable gate array (FPGA)
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Stated Internal Frequency 667 MHz —
Maximum Inputs or Outputs 400 I/O —
封装 676-BGA —
Reported Package Dimensions 23 mm x 23 mm —
Reported Package Pitch 1 mm —
Temperature Designation I (industrial) —
工作温度 0 C to 85 C; conflicting source also reports -40 C to 100 C -40°C to +100°C
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Programmable Architecture Field-configurable digital logic —
安装类型 Surface mount Surface mount
Manufacturer AMD / Xilinx —
RoHS 状态 unknown —
REACH Status unknown —
AEC-Q100 Status unknown —
Internal Frequency — 667 MHz
Input/Output Count — 408 I/O
电源电压 — 1 V
Speed Grade — -2
Process Technology — 45 nm CMOS
Package Type — 676-ball FBGA
Package Dimensions — 27 mm × 27 mm
Ball Pitch — 1 mm
Lead-Free Status — Lead free
Device Family — Spartan-6 LX
FPGA Configuration — [DATA_NEEDED: FPGA configuration interface and supported configuration modes]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP slice count]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

数据手册与资源

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