10AS048H1F34E1HG - Arria 10 SX SoC FPGA, 480K LE, Dual A9, 1152-FBGA | Intel (Altera)
MPN： 10AS048H1F34E1HG ✓ 啟用中10AS048H1F34E1HG 概覽
A System-on-Chip FPGA (SoC FPGA) is a single silicon device that combines a general-purpose processor subsystem with programmable FPGA fabric on the same die, allowing deterministic hardware acceleration alongside software execution. In the taxonomy of integrated circuits, SoC FPGAs sit above microcontrollers (fixed peripherals) and below pure ASICs (no field programmability). The Arria 10 SX family specifically targets mid-range applications that need ARM Cortex-A9 software plus parallel logic and DSP, bridging the gap between Cyclone V/V SoC (low power) and Stratix 10 SX (high performance).
Key features of this variant include 480K adaptive logic modules (ALMs), transceivers supporting multi-gigabit serial links, hard memory controllers for DDR3/DDR4, and a dual ARM Cortex-A9 MPCore with NEON and FPU extensions. The integrated HPS exposes common interfaces such as USB, Ethernet, SD/MMC, UART, SPI, and I2C through pin multiplexing. Industrial temperature grade (E1) ensures operation from -40C to +100C (junction).
The architecture pairs a 20 nm process technology with hard IP blocks for PCIe Gen2/Gen3, memory controllers, and variable-precision DSP. Designers can leverage Quartus Prime Pro for synthesis, place-and-route, and HPS firmware development using ARM DS-5 / SoC EDS toolchains. Per the Intel Arria 10 device overview, the SX family shares the same transceiver and fabric IP as the GX/GT variants but adds the hardened processor subsystem.
Typical applications include industrial motor control with software stacks, software-defined radio (SDR) baseband preprocessing, machine vision pipelines, broadcast video processing, and telecom line cards. The wide operating temperature range also makes the part suitable for defense and aerospace prototyping where deterministic hardware/software partitioning is required.
When designing with this SoC FPGA, allocate HPS pin multiplexing and EMIF routing early in the schematic phase, and verify the 1152-FBGA land pattern with the manufacturer package file before committing to PCB layout. Power sequencing for the HPS and FPGA rails must follow the Power Management IC (PMIC) reference design or the integrated Sequencer.
This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design notes not found in the manufacturer datasheet alone, enabling faster procurement and design-in decisions for engineering teams.
直接替換替代品，適用於 10AS048H1F34E1HG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS048H1F34E1HG （相同外形與佔位） — 差異在於 Package, Mounting Type, RoHS Status, Operating Temperature, Transceivers.
10AS048H2F34E1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS048H1F34E2HG
✅ 直接替換📋 參考替代品（不在目錄中）
10AS048H1F34I1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS048H1F34E1SG
✅ 直接替換📋 參考替代品（不在目錄中）
10AS048H1F34E3HG
✅ 直接替換📋 參考替代品（不在目錄中）
10AS048E2F29E1HG
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AS048H1F34E1HG 最大額定值與電氣特性
| Series | Arria 10 SX |
| Device Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Architecture | Hard Processor System (HPS) + Programmable Logic |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 480K |
| User I/O Count | 492 |
| Operating Frequency (HPS) | 1.5 GHz |
| 封裝 | 1152-FBGA, FC (35x35 mm) |
| Process Technology | 20 nm |
| Temperature Grade | Industrial (E1) |
| RoHS 狀態 | Compliant (HG suffix) |
| 安裝類型 | Surface Mount (flip-chip BGA) |
| Memory Interfaces | DDR3 / DDR4 with hard controllers |
| Transceivers | Multi-gigabit (per H1 grade) |
| DSP Blocks | Variable-precision DSP (per Arria 10 family) |
10AS048H1F34E1HG 1152-fbga, fc (35x35 mm) 腳位配置指南
10AS048H1F34E1HG（1152-fbga, fc (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS048H1F34E1HG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS048H1F34E1HG 適用於 6 應用s: Industrial Motor Control & Drive, Software-Defined Radio (SDR) Baseband, Machine Vision & Industrial Imaging, Broadcast Video Processing, Telecom Line Cards & Baseband, Defense & Aerospace Prototyping.
Industrial Motor Control & Drive
The 10AS048H1F34E1HG fits industrial motor control because the dual ARM Cortex-A9 HPS at 1.5 GHz runs real-time control loops (field-oriented control, sensorless algorithms) while the 480K logic elements deliver deterministic PWM generation and high-speed current sampling. The 1152-FBGA package provides 492 user I/O, sufficient for multi-axis encoder inputs, gate driver interfaces, and EtherCAT/MII side-band. Industrial temperature grade (E1) supports -40C to +100C junction operation typical in factory-floor cabinets. The hard memory controllers interface directly to DDR3/DDR4 for tuning parameter storage and runtime telemetry. Reference companion MPNs: 10AS048E2F29E1HG (lower-I/O variant for single-axis drives), H5AN8G4NAFR-UHC (DDR4 memory for control buffers), MT40A1G8AG-062E (DDR3 for legacy drive boards).
推薦
Software-Defined Radio (SDR) Baseband
For SDR baseband preprocessing, the 10AS048H1F34E1HG delivers the parallel DSP throughput required for FFT, channelization, and demodulation in LTE/5G NR waveforms. The H1 high-performance transceivers enable multi-gigabit links to RF front-end ADCs/DACs, while the 480K ALMs handle wideband digital down-conversion (DDC) at baseband sample rates. The dual ARM Cortex-A9 cores implement MAC scheduling, link adaptation, and network-stack offload. Industrial temperature grade supports outdoor small-cell and tactical SDR deployments. Reference companion MPNs: 10AS048H2F34E1HG (higher transceiver speed grade for wider RF bandwidths), MT62F3G32D8DV-023 (LPDDR for high-bandwidth sample buffering), 10AS032H1F34E1HG (smaller 10AS032 die for lower-power secondary channel).
推薦
Machine Vision & Industrial Imaging
The 10AS048H1F34E1HG fits machine vision pipelines because 480K logic elements can absorb multiple image-sensor ISP stages - debayering, lens distortion correction, color space conversion, and CNN acceleration - while the dual ARM Cortex-A9 HPS runs the application stack (object detection, sorting logic, PLC comms). The 1152-FBGA package's 492 user I/O connect multiple MIPI/parallel image sensors and 10GigE vision outputs. Hard PCIe Gen2/Gen3 enables frame grabber card integration. Industrial temperature supports factory-floor deployment near motors and welders. Reference companion MPNs: MT25QL256BBB8E12-CAUT (QSPI flash for bitstream and firmware), 10AS048E2F29I1HG (smaller F29 variant for cost-optimized single-camera systems), H5AN8G8NAFR-UHC (DDR4 for image buffers).
推薦
Broadcast Video Processing
For broadcast video (SDI routing, up/down/cross conversion, HDR/WCG mapping), the 10AS048H1F34E1HG provides sufficient DSP and logic for 4K/UHD real-time processing at 60 fps. The HPS manages file playback and metadata, while the FPGA fabric handles pixel-rate video pipelines at multiple rates simultaneously. The 1152-FBGA's high I/O count supports multi-channel SDI (SD/HD/3G/6G/12G) and HDMI 2.0 outputs via external PHY bridges. Industrial temperature suits studio equipment racks. Reference companion MPNs: M25P80-VMN3TPB (SPI flash for video assets), MT53E128M32D2FW-046 (LPDDR4 for frame buffers), 10AS032H2F35E2SG (smaller Arria 10 SX variant for I/O-limited sub-systems).
推薦
Telecom Line Cards & Baseband
In telecom line cards, the 10AS048H1F34E1HG interfaces to backplanes (via multi-gigabit transceivers), handles Layer 2/3 packet processing in FPGA fabric, and runs control-plane software on the ARM Cortex-A9 HPS. Hard PCIe Gen3 enables connectivity to host processors or co-processors; the 1152-FBGA F34 package is the line-card platform of choice for mid-range Arria 10 designs. Reference companion MPNs: N25Q256A13ESFA0F (QSPI for boot + firmware), MT40A2G8AG-062E (DDR3 for packet buffers), 10AS048H2F34E1HG (higher-speed transceiver for 100G+ backplane links).
推薦
Defense & Aerospace Prototyping
The industrial-grade (E1) and higher screening variants (SG military-grade) of 10AS048H1F34E1HG suit defense and aerospace prototyping. The hardened ARM Cortex-A9 HPS enables secure boot and crypto acceleration in FPGA fabric; the SoC partitioning supports MIL-STD-1553, ARINC 429, and other avionics databuses. Industrial temperature grade supports -40C to +100C junction operation; the 1152-FBGA F34 footprint is widely adopted in defense electronics form factors. Reference companion MPNs: 10AS048H1F34E1SG (military screening variant), N25Q032A13EV7A0 (radiation-tolerant-compatible QSPI), MT41K256M8DA-125 (legacy DDR3 for legacy interfaces).
推薦
推薦產品摘要
工程參考資料，適用於 10AS048H1F34E1HG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS048H2F34E1HG | 10AS048H1F34E2HG | 10AS048H1F34I1HG | 10AS048H1F34E1SG | 10AS048E2F29E1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 780-FBGA (F29) - DIFFERENT |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 480K | 480K - same | 480K - same | 480K - same | 480K - same | 480K - same |
| User I/O | 492 | 492 - same | 492 - same | 492 - same | 492 - same | ~370 - fewer I/O (F29 package) |
| Transceiver Grade | H1 (high-speed) | H2 - higher speed grade | H1 - same | H1 - same | H1 - same | E2 - lower speed grade |
| Temperature Grade | Industrial (E1, -40C to +100C Tj) | Industrial (E1) - same | Extended (E2) | Industrial (I1) | Military (SG) - wider temp range | Industrial (E1) - same |
| HPS Frequency | 1.5 GHz | 1.5 GHz - same | 1.5 GHz - same | 1.5 GHz - same | 1.5 GHz - same | 1.5 GHz - same |
主要差異化特點
- Highest-grade transceiver in F34 1152-FBGA package at industrial temperature (對比10AS048H2F34E1HG)
- Industrial temperature in F34 1152-FBGA package - sweet spot for line-card deployments (對比10AS048E2F29E1HG)
- Hardened ARM Cortex-A9 dual-core HPS at 1.5 GHz (對比Stratix 10 SX SoC FPGAs)
設計說明
Arria 10 SX devices require multi-rail sequencing (typically 0.95V, 1.1V, 1.8V, 3.3V) following the Power Management IC (PMIC) reference design. Use the integrated SmartVID controller to dynamically scale core voltage based on temperature/process. Decoupling: place 0402/0201 ceramic caps every 5-8 mm adjacent to BGA balls, with bulk capacitors (22 uF X5R) at each supply island. Estimated core current for 480K LE at 100% utilization is 5-8 A, requiring 4+ power layers with 1-oz copper. Power sequencing must complete before the HPS Cortex-A9 reset is deasserted to prevent lock-up.
The 35x35 mm 1152-FBGA FC package has a theta_JB (junction-to-board) of approximately 0.15 C/W - thermal performance is dominated by the PCB BGA land pattern and inner copper layers, not a heatsink. The flip-chip BGA uses a heat spreader/lid option; with lid, theta_JB can drop below 0.05 C/W. For industrial E1 temperature operation, ensure the package has a properly soldered lid or a custom heatsink with thermal interface material rated for the application. Estimate: at 25 W total power and theta_JA 5 C/W, junction rises 125 C - lid/heat-sink mandatory.
The 1152-FBGA F34 footprint is a 1.0 mm pitch ball grid. PCB design rules: minimum 4-6 routing layers with microvia-in-pad or laser-drilled stacked vias for inner-row escape; 0.5 oz copper on outer layers with 1-oz on inner power/ground pairs. Use Intel's Arria 10 Symbol and PCB decal libraries (downloaded from the Intel FPGA pin-out files) to ensure ball placement matches. Pair the BGA with a 4-layer stackup of power-ground-signal-signal to maintain signal integrity on DDR3/4 and transceiver lanes.
Common mistakes: (1) Omitting the HPS reset supervisor - the Cortex-A9 cores need proper power-on-reset sequencing; (2) Using a single 3.3V rail for the FPGA core - this destroys the device; (3) Mistaking the F29 (780-pin) package for F34 (1152-pin) - they are NOT pin-compatible and require different PCBs; (4) Forgetting JTAG pull-ups on TCK/TMS/TDI; (5) Neglecting the CONFIG_DONE pin pull-up or LED indication - bitstream loading failures are silent otherwise. Always validate with the Intel Cyclone/Arria 10 board check tools before fab.
合規資訊
Per Intel (Altera) ordering code, the HG suffix confirms RoHS / lead-free compliance. The part is not AEC-Q100 qualified (FPGA SoC, not automotive grade). Halogen-free status not explicitly stated in verified data - set to unknown.