10AS048H1F34I1HG - Arria 10 SX 480K LE SoC FPGA | Intel
MPN： 10AS048H1F34I1HG ✓ 啟用中10AS048H1F34I1HG 概覽
What is an SoC FPGA? An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines a traditional FPGA fabric with a hard processor system on a single die. The hard processor system - in this case dual ARM Cortex-A9 cores - executes operating systems and control code deterministically, while the FPGA fabric implements custom accelerators, DSP pipelines, and high-speed interfaces. This integration reduces bill-of-material cost, lowers latency between processor and fabric, and shrinks board area compared to a discrete CPU-plus-FPGA two-chip solution.
Key features include 480,000 logic elements, an integrated dual-core ARM Cortex-A9 MPCore with CoreSight debug, 1.5 GHz maximum processor frequency, and a 1152-ball Fine-pitch Ball Grid Array (FC-FBGA) package suitable for high-density PCB designs. The Arria 10 SX architecture supports high-speed transceivers, embedded DSP blocks, and substantial on-chip memory, enabling designers to consolidate DSP, packet processing, and control functions onto one device.
Technical depth: the Arria 10 SX family is built on TSMC's 20 nm process, providing a balanced trade-off between power efficiency, performance, and cost. The hard processor subsystem integrates NEON media processing engines, single/double-precision floating-point units, L1 and L2 caches, and a rich set of peripherals (EMAC, USB, NAND, SD/MMC, SPI, I2C, UART). The FPGA fabric communicates with the HPS through high-bandwidth AXI bridges, allowing hardware accelerators in the fabric to be memory-mapped into the CPU address space.
Typical applications include high-performance industrial imaging, radar and electronic warfare signal processing, 5G baseband prototyping, military secure communications, and broadcast video infrastructure. The combination of dual ARM cores plus 480K logic elements suits mid- to high-density embedded systems where deterministic real-time control and parallel DSP processing coexist.
Design consideration: the 1152-ball FC-FBGA requires high-layer-count PCB stack-ups (typically 12+ layers) with microvia technology, controlled-impedance routing for the HPS DDR3/4 interfaces, and careful power-rail decoupling. Designers must also budget for the device's thermal envelope: high transceiver utilization can drive junction temperatures near the 100 C limit without a heatsink or airflow.
This page synthesizes distributor stock data, pricing, and drop-in same-family alternatives for the Arria 10 SX family - practical context not found in the manufacturer datasheet alone.
直接替換替代品，適用於 10AS048H1F34I1HG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS048H1F34I1HG （相同外形與佔位） — 差異在於 Package, Operating Temperature, Transceivers, Mounting Type, Speed Grade.
10AS048H1F34E1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS032H1F34I1HG
✅ 直接替換聯絡詢價
查看資料表 →10AS048E4F29I3SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048E4F29I3LG
✅ 直接替換聯絡詢價
查看資料表 →10AS048H1F34I1HG 最大額定值與電氣特性
| Family | Arria 10 SX |
| Device Type | System-on-Chip (SoC) FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum Processor Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| I/O Count | 492 user I/O |
| 封裝 | 1152-ball FC-FBGA (35x35 mm) |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | -40 C to +100 C (industrial) |
| Speed Grade | 1 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
10AS048H1F34I1HG 1152-ball fc-fbga (35x35 mm) 腳位配置指南
10AS048H1F34I1HG（1152-ball fc-fbga (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS048H1F34I1HG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS048H1F34I1HG 適用於 6 應用s: High-Performance Industrial Imaging and Machine Vision, Radar and Electronic Warfare Signal Processing, 5G Baseband and Radio Prototyping, Military Secure Communications, Broadcast Video Infrastructure and Studio Processing, Medical Imaging Systems (CT, Ultrasound, MRI Back-End).
High-Performance Industrial Imaging and Machine Vision
The 10AS048H1F34I1HG suits multi-camera machine-vision systems where image preprocessing must run at line rate before inspection decisions. Its 480K logic elements implement parallel pipelines for Bayer demosaicing, lens-distortion correction, and CNN inference, while the dual ARM Cortex-A9 HPS at 1.5 GHz runs Linux for PLC coordination, HMI, and protocol stacks (EtherCAT, PROFINET). The 492 user I/O handle Camera Link, CoaXPress, or GigE Vision interfaces, and the FC-FBGA package sustains industrial -40 C to +100 C operation. Estimated: at 70% logic utilization the device draws approximately 18-22 W, so designers budget a 25 W thermal envelope with 200 LFM airflow.
推薦
Radar and Electronic Warfare Signal Processing
The 10AS048H1F34I1HG targets phased-array radar baseband and electronic-countermeasure systems where FFT, pulse compression, and digital beamforming must execute in microseconds. The 480K logic elements map to thousands of 18x19 multipliers and embedded DSP blocks, while the dual ARM cores handle scheduling, calibration, and Ethernet control planes. The Arria 10 SX architecture supports 17 Gbps transceivers for direct ADC interfacing and reduced latency to downstream processing. Industrial temperature grade allows deployment in ruggedized enclosures. Designers typically pair this SoC with external DDR4 for capture buffers.
推薦
5G Baseband and Radio Prototyping
The 10AS048H1F34I1HG is well suited to 4G/5G baseband prototyping, where massive MIMO and LDPC decoding demand thousands of DSP operations per subframe. The 480K logic elements host channel encoders, FFT/IFFT cores, and crest-factor-reduction engines, while the dual ARM Cortex-A9 HPS runs the MAC scheduler and upper-layer stacks. The 1152-ball FC-FBGA package supports the high pin density required for multi-antenna transceiver fan-out. Operating up to 100 C junction, the device fits thermally constrained indoor radio units. Expect approximately 25 W device dissipation at full transceiver utilization.
推薦
Military Secure Communications
The 10AS048H1F34I1HG supports tactical radio and secure-comm gateway designs where cryptographic acceleration and software-defined-radio waveforms coexist on a single device. The dual ARM cores handle Type-1 crypto APIs, key management, and IP routing, while the 480K logic fabric implements waveform-specific modulators, channelizers, and FEC decoders. Industrial temperature range suits vehicle and field-deployable enclosures, and the FC-FBGA package supports high-vibration environments with underfilled BGA attachment. Designers pair this SoC with external secure-boot Flash and battery-backed RAM.
推薦
Broadcast Video Infrastructure and Studio Processing
The 10AS048H1F34I1HG supports broadcast studio equipment such as video routers, multiviewers, and UHD format converters where real-time pixel processing exceeds GPU practicality. The 480K logic elements implement color-space conversion, scaling, frame-rate conversion, and overlay composition, while the dual ARM HPS runs control software and IP-based studio networks (SMPTE 2110, NMOS). The 1152-ball FC-FBGA provides the user I/O count required for multi-channel SDI and 12G-SDI inputs. Estimated: at 60% logic utilization with four 12G-SDI streams, the device draws approximately 15 W.
推薦
Medical Imaging Systems (CT, Ultrasound, MRI Back-End)
The 10AS048H1F34I1HG targets medical-imaging back-end processing, where raw sensor data requires real-time beamforming, image reconstruction, and noise filtering. The 480K logic elements implement parallel DSP pipelines for ultrasound beamforming or CT back-projection, while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and clinician-facing software. Industrial temperature range allows integration into stationary imaging carts and OR equipment. The SoC architecture eliminates the need for a separate host CPU, reducing system cost and patient-data latency.
推薦
推薦產品摘要
工程參考資料，適用於 10AS048H1F34I1HG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS048H1F34E1HG | 10AS032H1F34I1HG | 10AS048E4F29I3SG | 10AS048E4F29I3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35 mm) | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 480,000 | 480,000 | 320,000 | 480,000 | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | 1 (fastest) | 1 | 1 | 3 (slower) | 3 (lower power) |
| Temperature Grade | Industrial (-40 C to +100 C) | Extended | Industrial | Industrial | Industrial |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
主要差異化特點
- Highest logic density in the same 1152-ball FC-FBGA footprint (對比10AS032H1F34I1HG)
- Fastest speed grade in the Arria 10 SX 480K family (對比10AS048E4F29I3SG)
- Industrial temperature grade with full -40 C to +100 C support (對比10AS048H1F34E1HG)
- True SoC integration eliminates external host CPU (對比10AS048 (GX variant without HPS))
設計說明
The 1152-ball FC-FBGA package at 1.0 mm ball pitch requires a high-layer-count PCB stack-up (12 layers or more) with laser-drilled microvias for fan-out. Use a symmetric stack-up to prevent BGA warpage during reflow, and follow Intel's via-in-pad recommendations for the inner rows of the BGA. Allocate at least 4 internal layers to solid ground and 2 to power for return-path integrity on the high-speed HPS DDR3/4 interfaces.
Estimated: at 70% logic utilization with active transceivers, the 10AS048H1F34I1HG dissipates 18-22 W; at full utilization with all transceivers active, dissipation can reach 30+ W. The 35x35 mm FC-FBGA has a thermal resistance of approximately 1.0 C/W with the recommended thermal via array and thermal interface material. Use a heatsink plus 200 LFM airflow for industrial-grade reliability, and simulate the junction-to-ambient thermal path in your mechanical CAD before committing to layout.
The Arria 10 SX SoC requires multiple power rails: 0.9 V core, 1.1 V auxiliary, 1.5 V/1.8 V/2.5 V/3.0 V user I/O banks, 1.2 V DDR3/4 for the HPS, and 1.8 V/2.5 V for transceiver channels. Use a PowerTree-aware sequencing controller (such as the LTC2977 or LTM4677) to enforce Intel's power-up and power-down sequencing requirements; incorrect sequencing can latch-up the device. Decouple every rail with bulk ceramic and polymer capacitors placed within 100 mil of each BGA power pin.
HPS DDR3/4 interfaces require matched-length routing within +/-25 mil across the byte lane and matched impedance of 50 ohm single-ended (100 ohm differential for DDR4). The FPGA fabric's high-speed transceivers need 85-100 ohm differential routing with length matching within +/-0.1 mm across the P and N pairs. Use Intel's Quartus Prime Pin Planner and the Arria 10 EMIF Toolkit to validate DDR timing closure before fabrication.
Do not confuse the H (industrial temperature) suffix with the E (extended) suffix when sourcing - the E variant is for harsher ambient conditions. Also avoid the F35 vs F34 package code distinction - F35 indicates a different transceiver lane count, which changes the BGA ball map. Always verify the exact MPN against Intel's ordering information guide before issuing a purchase order. Note: cross-package alternatives such as the 10AS048H4F35I3SG (1517-ball BGA) are NOT drop-in and require PCB rework.
合規資訊
RoHS and lead-free compliance confirmed via distributor listings. AEC-Q100 not applicable (industrial/extended-grade part, not automotive-qualified). Conflict-minerals compliance per Intel corporate policy.
