10AS048H1F34E1HG - Arria 10 SX SoC FPGA, 480K LE, Dual A9, 1152-FBGA | Intel (Altera)
MPN: 10AS048H1F34E1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3673.53 | $3,673.53 |
| 10 | $3538.42 | $35,384.20 |
| 100 | $3389.15 | $338,915.00 |
| 500 | $3224.07 | $1,612,035.00 |
| 1,000 | $3048.91 | $3,048,910.00 |
Drop-in alternatives for 10AS048H1F34E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048H2F34E1HG
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$3650 / Unit
View Datasheet →10AS048H1F34E2HG
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10AS048H1F34I1HG
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$2650 / Unit
View Datasheet →10AS048H1F34E1SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048H1F34E3HG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048E2F29E1HG
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View Datasheet →10AS048H1F34E1HG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Device Type | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| Architecture | Hard Processor System (HPS) + Programmable Logic |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 480K |
| User I/O Count | 492 |
| Operating Frequency (HPS) | 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| Process Technology | 20 nm |
| Temperature Grade | Industrial (E1) |
| RoHS Status | Compliant (HG suffix) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Memory Interfaces | DDR3 / DDR4 with hard controllers |
| Transceivers | Multi-gigabit (per H1 grade) |
| DSP Blocks | Variable-precision DSP (per Arria 10 family) |
10AS048H1F34E1HG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS048H1F34E1HG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H1F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H1F34E1HG is suitable for 6 applications: Industrial Motor Control & Drive, Software-Defined Radio (SDR) Baseband, Machine Vision & Industrial Imaging, Broadcast Video Processing, Telecom Line Cards & Baseband, Defense & Aerospace Prototyping.
Industrial Motor Control & Drive
The 10AS048H1F34E1HG fits industrial motor control because the dual ARM Cortex-A9 HPS at 1.5 GHz runs real-time control loops (field-oriented control, sensorless algorithms) while the 480K logic elements deliver deterministic PWM generation and high-speed current sampling. The 1152-FBGA package provides 492 user I/O, sufficient for multi-axis encoder inputs, gate driver interfaces, and EtherCAT/MII side-band. Industrial temperature grade (E1) supports -40C to +100C junction operation typical in factory-floor cabinets. The hard memory controllers interface directly to DDR3/DDR4 for tuning parameter storage and runtime telemetry. Reference companion MPNs: 10AS048E2F29E1HG (lower-I/O variant for single-axis drives), H5AN8G4NAFR-UHC (DDR4 memory for control buffers), MT40A1G8AG-062E (DDR3 for legacy drive boards).
Recommended
Software-Defined Radio (SDR) Baseband
For SDR baseband preprocessing, the 10AS048H1F34E1HG delivers the parallel DSP throughput required for FFT, channelization, and demodulation in LTE/5G NR waveforms. The H1 high-performance transceivers enable multi-gigabit links to RF front-end ADCs/DACs, while the 480K ALMs handle wideband digital down-conversion (DDC) at baseband sample rates. The dual ARM Cortex-A9 cores implement MAC scheduling, link adaptation, and network-stack offload. Industrial temperature grade supports outdoor small-cell and tactical SDR deployments. Reference companion MPNs: 10AS048H2F34E1HG (higher transceiver speed grade for wider RF bandwidths), MT62F3G32D8DV-023 (LPDDR for high-bandwidth sample buffering), 10AS032H1F34E1HG (smaller 10AS032 die for lower-power secondary channel).
Recommended
Machine Vision & Industrial Imaging
The 10AS048H1F34E1HG fits machine vision pipelines because 480K logic elements can absorb multiple image-sensor ISP stages - debayering, lens distortion correction, color space conversion, and CNN acceleration - while the dual ARM Cortex-A9 HPS runs the application stack (object detection, sorting logic, PLC comms). The 1152-FBGA package's 492 user I/O connect multiple MIPI/parallel image sensors and 10GigE vision outputs. Hard PCIe Gen2/Gen3 enables frame grabber card integration. Industrial temperature supports factory-floor deployment near motors and welders. Reference companion MPNs: MT25QL256BBB8E12-CAUT (QSPI flash for bitstream and firmware), 10AS048E2F29I1HG (smaller F29 variant for cost-optimized single-camera systems), H5AN8G8NAFR-UHC (DDR4 for image buffers).
Recommended
Broadcast Video Processing
For broadcast video (SDI routing, up/down/cross conversion, HDR/WCG mapping), the 10AS048H1F34E1HG provides sufficient DSP and logic for 4K/UHD real-time processing at 60 fps. The HPS manages file playback and metadata, while the FPGA fabric handles pixel-rate video pipelines at multiple rates simultaneously. The 1152-FBGA's high I/O count supports multi-channel SDI (SD/HD/3G/6G/12G) and HDMI 2.0 outputs via external PHY bridges. Industrial temperature suits studio equipment racks. Reference companion MPNs: M25P80-VMN3TPB (SPI flash for video assets), MT53E128M32D2FW-046 (LPDDR4 for frame buffers), 10AS032H2F35E2SG (smaller Arria 10 SX variant for I/O-limited sub-systems).
Recommended
Telecom Line Cards & Baseband
In telecom line cards, the 10AS048H1F34E1HG interfaces to backplanes (via multi-gigabit transceivers), handles Layer 2/3 packet processing in FPGA fabric, and runs control-plane software on the ARM Cortex-A9 HPS. Hard PCIe Gen3 enables connectivity to host processors or co-processors; the 1152-FBGA F34 package is the line-card platform of choice for mid-range Arria 10 designs. Reference companion MPNs: N25Q256A13ESFA0F (QSPI for boot + firmware), MT40A2G8AG-062E (DDR3 for packet buffers), 10AS048H2F34E1HG (higher-speed transceiver for 100G+ backplane links).
Recommended
Defense & Aerospace Prototyping
The industrial-grade (E1) and higher screening variants (SG military-grade) of 10AS048H1F34E1HG suit defense and aerospace prototyping. The hardened ARM Cortex-A9 HPS enables secure boot and crypto acceleration in FPGA fabric; the SoC partitioning supports MIL-STD-1553, ARINC 429, and other avionics databuses. Industrial temperature grade supports -40C to +100C junction operation; the 1152-FBGA F34 footprint is widely adopted in defense electronics form factors. Reference companion MPNs: 10AS048H1F34E1SG (military screening variant), N25Q032A13EV7A0 (radiation-tolerant-compatible QSPI), MT41K256M8DA-125 (legacy DDR3 for legacy interfaces).
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H1F34E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H2F34E1HG | 10AS048H1F34E2HG | 10AS048H1F34I1HG | 10AS048H1F34E1SG | 10AS048E2F29E1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 1152-FBGA (F34) - same | 780-FBGA (F29) - DIFFERENT |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 480K | 480K - same | 480K - same | 480K - same | 480K - same | 480K - same |
| User I/O | 492 | 492 - same | 492 - same | 492 - same | 492 - same | ~370 - fewer I/O (F29 package) |
| Transceiver Grade | H1 (high-speed) | H2 - higher speed grade | H1 - same | H1 - same | H1 - same | E2 - lower speed grade |
| Temperature Grade | Industrial (E1, -40C to +100C Tj) | Industrial (E1) - same | Extended (E2) | Industrial (I1) | Military (SG) - wider temp range | Industrial (E1) - same |
| HPS Frequency | 1.5 GHz | 1.5 GHz - same | 1.5 GHz - same | 1.5 GHz - same | 1.5 GHz - same | 1.5 GHz - same |
| Unit Price (USD, qty 1, as of 2026-09-05) | $3,673.53 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-grade transceiver in F34 1152-FBGA package at industrial temperature (vs 10AS048H2F34E1HG)
- Industrial temperature in F34 1152-FBGA package - sweet spot for line-card deployments (vs 10AS048E2F29E1HG)
- Hardened ARM Cortex-A9 dual-core HPS at 1.5 GHz (vs Stratix 10 SX SoC FPGAs)
Design Notes
Arria 10 SX devices require multi-rail sequencing (typically 0.95V, 1.1V, 1.8V, 3.3V) following the Power Management IC (PMIC) reference design. Use the integrated SmartVID controller to dynamically scale core voltage based on temperature/process. Decoupling: place 0402/0201 ceramic caps every 5-8 mm adjacent to BGA balls, with bulk capacitors (22 uF X5R) at each supply island. Estimated core current for 480K LE at 100% utilization is 5-8 A, requiring 4+ power layers with 1-oz copper. Power sequencing must complete before the HPS Cortex-A9 reset is deasserted to prevent lock-up.
The 35x35 mm 1152-FBGA FC package has a theta_JB (junction-to-board) of approximately 0.15 C/W - thermal performance is dominated by the PCB BGA land pattern and inner copper layers, not a heatsink. The flip-chip BGA uses a heat spreader/lid option; with lid, theta_JB can drop below 0.05 C/W. For industrial E1 temperature operation, ensure the package has a properly soldered lid or a custom heatsink with thermal interface material rated for the application. Estimate: at 25 W total power and theta_JA 5 C/W, junction rises 125 C - lid/heat-sink mandatory.
The 1152-FBGA F34 footprint is a 1.0 mm pitch ball grid. PCB design rules: minimum 4-6 routing layers with microvia-in-pad or laser-drilled stacked vias for inner-row escape; 0.5 oz copper on outer layers with 1-oz on inner power/ground pairs. Use Intel's Arria 10 Symbol and PCB decal libraries (downloaded from the Intel FPGA pin-out files) to ensure ball placement matches. Pair the BGA with a 4-layer stackup of power-ground-signal-signal to maintain signal integrity on DDR3/4 and transceiver lanes.
Common mistakes: (1) Omitting the HPS reset supervisor - the Cortex-A9 cores need proper power-on-reset sequencing; (2) Using a single 3.3V rail for the FPGA core - this destroys the device; (3) Mistaking the F29 (780-pin) package for F34 (1152-pin) - they are NOT pin-compatible and require different PCBs; (4) Forgetting JTAG pull-ups on TCK/TMS/TDI; (5) Neglecting the CONFIG_DONE pin pull-up or LED indication - bitstream loading failures are silent otherwise. Always validate with the Intel Cyclone/Arria 10 board check tools before fab.
Compliance Information
Per Intel (Altera) ordering code, the HG suffix confirms RoHS / lead-free compliance. The part is not AEC-Q100 qualified (FPGA SoC, not automotive grade). Halogen-free status not explicitly stated in verified data - set to unknown.
