10CX105YU484E6G - 104K LE Cyclone 10 GX FPGA 484-BGA | Intel
MPN： 10CX105YU484E6G ✓ 啟用中10CX105YU484E6G 概覽
A field-programmable gate array (FPGA) is a reconfigurable semiconductor integrated circuit whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit within the programmable-logic device (PLD) hierarchy, which also includes complex programmable logic devices (CPLDs). Architecturally, an FPGA such as the Cyclone 10 GX combines look-up tables (LUTs), flip-flops, block RAM (BRAM), DSP slices, phase-locked loops (PLLs), and increasingly hard intellectual property (IP) cores such as PCIe controllers and multi-gigabit transceivers. This heterogeneity makes FPGAs preferred glue logic, accelerator, and connectivity platforms for embedded, industrial, video, and communications designs.
Key differentiating features of the 10CX105YU484E6G include six 12.5 Gbps transceivers, hard PCIe Gen2 x4 IP, up to 480 DSP blocks, 188 single-ended (or 94 differential-pair) general-purpose I/Os, and 3.125 Gbps LVDS support. The device supports LPDDR2, DDR3, and DDR3L external memory interfaces with soft physical layer (PHY) IP, and offers a hardened floating-point arithmetic block set for DSP workloads. Its 20 nm process enables a low static power profile relative to prior 28 nm Cyclone generations.
The 10CX105YU484E6G is a fit for high-volume applications such as industrial machine vision with GigE Vision or CoaXPress interfaces, broadcast video processing and encoding, motor control and industrial drive systems, wireless backhaul baseband, and embedded PCIe expansion cards. The integrated 12.5 Gbps transceivers remove the need for external PHY chips on most serial links. Designers targeting low-cost video, HMI, or smart-factory edge nodes benefit from the large logic capacity combined with low-power operation. For designs previously locked to Arria II or earlier, the Cyclone 10 GX delivers substantially higher DSP throughput at comparable static power.
When designing in this part, engineers should budget for the device's 1.0 V core VCC supply sequencing and provide robust decoupling per Intel's Power Distribution Network (PDN) guidelines. Pin-out compatible speed-grade and density migrations exist within the Cyclone 10 GX family, allowing pin-compatible movement to lower-cost 10CX085 (85K LE) or higher-cost 10CX220 (220K LE) variants within the same UBGA-484 footprint, depending on yield. JTAG and active serial configuration via the Altera/Intel Quartus Prime toolchain are mandatory.
This page synthesizes verified distributor pricing, parametric alternatives within the Cyclone 10 GX family, and practical design notes that complement but do not duplicate the manufacturer datasheet.
直接替換替代品，適用於 10CX105YU484E6G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10CX105YU484E6G （相同外形與佔位） — 差異在於 Package, Operating Temperature, Logic Elements (LE), Transceivers, Mounting Type.
10CX105YU484E5G
✅ 直接替換聯絡詢價
查看資料表 →10CX085YU484E6G
✅ 直接替換聯絡詢價
查看資料表 →10CX085YU484E5G
✅ 直接替換聯絡詢價
查看資料表 →10CX105YU484E6G 最大額定值與電氣特性
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 104,000 |
| Registers / Flip-Flops | 104,000 |
| Embedded Memory Bits | 8,641,536 bits |
| DSP Blocks | Up to 480 |
| User I/O Count | 188 |
| Transceivers | Up to 6 channels at 12.5 Gbps |
| PCIe Hard IP | PCIe Gen2 x4 |
| Process Technology | 20 nm |
| 封裝 | 484-pin UBGA (19x19 mm) |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | Commercial / Extended per speed grade |
| Supply Voltage (Core VCC) | 0.9 V to 1.1 V (typ. 1.0 V) |
| Configuration | JTAG, Active Serial, Fast Passive Parallel |
| RoHS 狀態 | RoHS Compliant |
| MSL 等級 | MSL3 (per JEDEC J-STD-020) |
10CX105YU484E6G 484-pin ubga (19x19 mm) 腳位配置指南
10CX105YU484E6G（484-pin ubga (19x19 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10CX105YU484E6G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10CX105YU484E6G 適用於 7 應用s: Industrial Machine Vision, Broadcast Video Processing, PCIe Endpoint Card / Embedded PCIe, Motor Control and Industrial Drives, Wireless Backhaul Baseband, Smart-Factory Edge Nodes / IoT Gateways, Test & Measurement Instrumentation.
Industrial Machine Vision
The 10CX105YU484E6G is well suited for industrial machine vision systems where multi-gigabit serial links, real-time DSP, and large logic capacity must coexist in a low-power FPGA. The device integrates six 12.5 Gbps transceivers that natively drive CoaXPress 2.0, 10 GigE Vision, or Camera Link HS interfaces, eliminating external PHY ICs and reducing BOM cost per camera channel. Up to 480 DSP blocks accelerate Bayer demosaicing, color-space conversion, and edge-detection kernels, achieving real-time throughput at 4K resolutions. The 8.6 Mbit embedded M20K memory buffers full image lines for line-scan cameras without external SRAM. Industrial-grade speed grades and the compact 484-pin UBGA package suit HMI panels and embedded vision PCs on factory floors.
推薦
Broadcast Video Processing
The 10CX105YU484E6G delivers 12G-SDI and 4K broadcast pipeline capability through its 12.5 Gbps transceivers and 480 DSP blocks. Each transceiver can be configured as a 12G-SDI or SMPTE ST 2059 receiver/transmitter, supporting single-link 4K60 transport without external reclockers. The 480 DSP blocks handle chroma resampling, scaling, and HDR conversion in real time at 4K frame rates. The 8.6 Mbit embedded memory provides frame-line buffers for cross-conversion and OSD overlay. With 188 user I/Os, the FPGA also aggregates multiple 3G-SDI streams for multi-camera broadcast switchers in a single device.
推薦
PCIe Endpoint Card / Embedded PCIe
The 10CX105YU484E6G integrates a PCIe Gen2 x4 hard IP block, enabling designers to implement cost-effective endpoint cards for industrial PCs, test instruments, and vision frame grabbers. The hard PCIe controller eliminates the soft-IP latency and resource overhead of older FPGA families, freeing logic for custom DSP. Combined with 12.5 Gbps transceivers, the FPGA can simultaneously expose PCIe control-plane and multi-gigabit serial data-plane interfaces such as 10 GbE to the host. The UBGA-484 footprint and 1.0 V core supply ease integration on standard PCIe card PCB stack-ups.
推薦
Motor Control and Industrial Drives
The 10CX105YU484E6G supports multi-axis motor control and industrial drive applications by combining high-performance logic, dedicated DSP blocks, and flexible I/O. Its DSP slices implement Field-Oriented Control (FOC) and space-vector PWM loops for multiple axes simultaneously at sub-microsecond rates. The 188 user I/Os accommodate multi-channel encoder interfaces (EnDat, BiSS, SSI) and high-bandwidth ADC sampling for current/voltage sensing. Industrial temperature grade and 20 nm low-power process suit long-life factory automation systems where ambient temperature and reliability matter.
推薦
Wireless Backhaul Baseband
The 10CX105YU484E6G provides sufficient DSP throughput and transceiver bandwidth for small-cell and wireless backhaul baseband processing at lower RF data rates. Its 480 DSP slices handle channel coding, equalization, and FFT/iFFT kernels for sub-6 GHz small cells and microwave backhaul modems. The 12.5 Gbps transceivers carry CPRI or eCPRI fronthaul to baseband units. Compared with higher-end Arria 10 parts, the Cyclone 10 GX delivers cost-effective density for mid-tier baseband where BOM is critical.
推薦
Smart-Factory Edge Nodes / IoT Gateways
The 10CX105YU484E6G serves as a flexible I/O and protocol-conversion hub for smart-factory edge nodes, aggregating fieldbus (EtherCAT, PROFINET, Modbus TCP) and converting to industrial Ethernet. Its 188 I/Os and 12.5 Gbps transceivers let the device handle multiple EtherCAT masters, OPC UA protocol bridging, and MQTT-to-cloud forwarding in a single chip. The 104K logic capacity supports secure-boot, encryption, and real-time analytics at the edge, reducing cloud round-trips. Low static power on 20 nm process allows fanless DIN-rail mounting in sealed cabinets.
推薦
Test & Measurement Instrumentation
The 10CX105YU484E6G fits mid-tier test and measurement instruments that need multi-channel high-speed data acquisition and protocol analysis. Its transceivers capture and decode 10 GbE, USB 3.x via external PHY, and PCIe Gen2 traffic, while its 480 DSP blocks perform FFT, correlation, and digital down-conversion for spectrum and protocol analyzers. The 8.6 Mbit embedded memory holds deep acquisition records, reducing the need for external SRAM. The UBGA-484 footprint enables compact modular instrument cards.
推薦
推薦產品摘要
工程參考資料，適用於 10CX105YU484E6G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10CX105YU484E5G | 10CX085YU484E6G | 10CX085YU484E5G |
|---|---|---|---|---|
| Brand | Intel (Cyclone 10 GX) | Intel (Cyclone 10 GX) | Intel (Cyclone 10 GX) | Intel (Cyclone 10 GX) |
| Package | UBGA-484 (U484, 19x19 mm) | UBGA-484 (U484) - same | UBGA-484 (U484) - same | UBGA-484 (U484) - same |
| Logic Elements | 104,000 | 104,000 | 85,000 (-18%) | 85,000 (-18%) |
| Transceivers / Speed | 6 ch @ 12.5 Gbps | 6 ch @ 10 Gbps (E5) | 6 ch @ 12.5 Gbps | 6 ch @ 10 Gbps |
| User I/O | 188 | 188 | 188 | 188 |
| PCIe Hard IP | PCIe Gen2 x4 | PCIe Gen2 x4 | PCIe Gen2 x4 | PCIe Gen2 x4 |
| Speed Grade | E6 (extended) | E5 (extended) | E6 (extended) | E5 (extended) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm |
主要差異化特點
- Highest-density 104K LE option within the U484 footprint (對比10CX085YU484E6G)
- 12.5 Gbps transceivers vs 10 Gbps in lower speed grade (對比10CX105YU484E5G)
- Hard PCIe Gen2 x4 block reduces logic overhead (對比10CL080YU484C8G (Cyclone 10 LP))
設計說明
The 10CX105YU484E6G requires a 1.0 V core VCC with tolerance to 0.9-1.1 V, plus separate VCCIO rails (typically 1.2/1.5/1.8/2.5/3.3 V) and a VCCAUX rail. Use a multi-rail sequencing controller to enforce monotonic ramp-up; the device will hold in reset until VCC reaches its POR threshold. Decoupling per Intel's PDN guidelines is mandatory: bulk capacitors at the supply pins, plus 0.1 uF and 1 nF ceramics as close to each ball pair as practical.
Estimated: at typical industrial applications driving 4 transceiver channels at 10 Gbps and ~60% logic utilization, total power consumption can approach 5-7 W. The 484-pin UBGA package relies on the PCB's inner copper ground planes and thermal vias to the top-side thermal pad. A minimum 4-layer PCB with 1 oz copper and a thermal via array under the package center pad is recommended; without adequate thermal relief, junction temperature can exceed 100 C in enclosed industrial cabinets.
Route differential transceiver pairs with 100 ohm differential impedance and controlled length matching per Intel's pinout file. Keep M20K memory interfaces to external DDR3/DDR3L on inner stripline layers with 50 ohm single-ended impedance and matched length (+/- 25 mil) across byte lanes. Use microstrip-to-stripline via transitions optimized for 12.5 Gbps signal integrity, and place AC-coupling capacitors within 200 mil of the BGA balls for high-speed links.
Do not assume Cyclone 10 GX OPNs with different package codes (U484 vs F780) share the same ball map - they are not pin-compatible. Verify the exact OPN against the device handbook pin table before PCB layout. Also, ensure configuration mode (AS, JTAG, FPP) is selected correctly via MSEL pins; wrong MSEL values lead to configuration failure with no clear error indicator beyond unsuccessful DONE pin assertion.
Place the JTAG header within 2 inches of the FPGA's JTAG pins with series 33 ohm damping resistors and a clean ground reference. The Active Serial (AS) configuration flash should sit within 4 inches of the FPGA with impedance-matched traces. Keep configuration pin traces away from clock and high-speed transceiver balls to avoid coupling during power-on reset.
合規資訊
RoHS compliance per DigiKey listing and Altera/Intel product page. Halogen-free status not explicitly stated in provided data. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade discrete. Conflict minerals compliance per Intel corporate policy.
