XC7A200T-1FBG484I - 740K Logic Cells FPGA | AMD Xilinx
MPN： XC7A200T-1FBG484I ✓ 啟用中| 數量 | 單價 | 小計 |
|---|---|---|
| 1 | $53.21 | $53.21 |
| 10 | $49.5 | $495.00 |
| 100 | $45.8 | $4,580.00 |
| 500 | $42.1 | $21,050.00 |
| 1,000 | $38.5 | $38,500.00 |
XC7A200T-1FBG484I 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that can be configured after manufacturing to implement custom digital circuits. FPGAs sit between ASICs (application-specific integrated circuits) and microprocessors in the design hierarchy, offering the flexibility of software-defined hardware with the parallelism of dedicated logic. The Artix-7 family is optimized for cost-sensitive, high-volume applications requiring high logic density and low power, positioned below the Kintex-7 and Virtex-7 families in AMD's 7-series portfolio.
Key features include 285 user I/O pins supporting up to 1.25 Gbps LVDS, 740 DSP48E1 slices with 25x18 multiplier capability, and 10 CMTs providing PLL and MMCM functions. The device also offers 13 Mb of block RAM organized as 365 36Kb blocks, enabling substantial on-chip data storage. The -1 speed grade provides balanced performance with 550 MHz maximum clock frequency, while the industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments.
The XC7A200T-1FBG484I is built on AMD's 28nm high-k metal gate (HKMG) process technology, delivering high performance with low static power. The architecture includes configurable logic blocks (CLBs) with 6-input look-up tables (LUTs), dedicated carry chains for arithmetic functions, and shift register capabilities. The device supports partial reconfiguration, allowing dynamic updates to logic functions without full device reprogramming, which is valuable for adaptive systems.
Typical applications include software-defined radio (SDR), medical imaging, industrial motor control, and high-performance computing acceleration. The high DSP count and low-latency I/O make it ideal for real-time signal processing in communications and defense systems. The 484-ball FBGA package with 1.0mm ball pitch enables compact PCB designs while providing adequate thermal dissipation for moderate power levels.
When designing with this FPGA, ensure adequate decoupling capacitors on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's PCB design guidelines for high-speed I/O. The configuration interface supports multiple modes including JTAG, SPI, and SelectMAP, allowing flexible system integration. Power sequencing must follow the recommended ramp rates to avoid latch-up or configuration failures.
直接替換替代品，適用於 XC7A200T-1FBG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7A200T-1FBG484I （相同外形與佔位） — 差異在於 Operating Temperature, Package, Speed Grade.
快速比較工具 — 選擇替代零件進行並排比較：
XC7A200T-1FBG484C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-2FBG484I
✅ 直接替換✗ 缺貨
$89.15 / 單位
查看資料表 →XC7A200T-3FBG484E
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-1SBG484I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7A200T-1FBG484I 最大額定值與電氣特性
| Family | Artix-7 |
| Logic Cells | 215360 |
| Logic Slices | 33650 |
| Block RAM | 13 Mb (365 x 36Kb blocks) |
| DSP Slices | 740 DSP48E1 |
| User I/O | 285 |
| I/O Standards | LVCMOS, LVDS, HSTL |
| Core Voltage | 0.95V to 1.05V |
| Speed Grade | -1 |
| Max Clock Frequency | 550 MHz |
| Clock Management Tiles | 10 CMTs (PLL/MMCM) |
| 封裝 | 484-BBGA, FCBGA |
| Ball Pitch | 1.0 mm |
| 工作溫度 | -40C to +100C (Industrial) |
| Process Technology | 28nm HKMG |
| Configuration Interfaces | JTAG, SPI, SelectMAP |
| RoHS 狀態 | Compliant |
XC7A200T-1FBG484I 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 腳位 A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 腳位 B1 | VCCINT — Core logic power supply (0.95V-1.05V) |
| 腳位 B2 | GND — Ground |
| 腳位 C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| 腳位 C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| 腳位 D1 | VCCAUX — Auxiliary power supply (1.8V) |
| 腳位 D2 | GND — Ground |
| 腳位 E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| 腳位 E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| 腳位 F1 | VCCO_0 — I/O bank 0 power supply |
| 腳位 F2 | GND — Ground |
典型應用
XC7A200T-1FBG484I 適用於 6 應用s: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, High-Performance Computing Acceleration, Defense and Aerospace Systems, Video and Image Processing.
Software-Defined Radio (SDR)
The XC7A200T-1FBG484I excels in SDR systems due to its 740 DSP48E1 slices and 13 Mb block RAM, enabling complex digital down-conversion and modulation algorithms. The 285 user I/O pins support high-speed ADC/DAC interfaces up to 1.25 Gbps LVDS, while the 10 CMTs provide precise clock generation for multi-channel operation. The industrial temperature range ensures reliable performance in field-deployed communication equipment.
推薦
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XC7A200T-1FBG484I provides the parallel processing power needed for real-time image reconstruction. Its 740 DSP slices handle beamforming and filtering operations, while the 13 Mb block RAM stores intermediate image data. The 28nm process technology minimizes power dissipation, critical for portable medical devices. The industrial temperature range supports operation in clinical environments.
推薦
Industrial Motor Control
The XC7A200T-1FBG484I enables high-performance motor control with its 740 DSP48E1 slices for implementing complex FOC (Field-Oriented Control) algorithms. The 285 I/O pins interface directly with PWM drivers and encoders, while the 10 CMTs generate precise timing signals. The -40C to +100C temperature range suits harsh factory environments. The FPGA's deterministic timing ensures consistent control loop performance.
推薦
High-Performance Computing Acceleration
The XC7A200T-1FBG484I accelerates compute-intensive workloads with its 740 DSP slices and 215,360 logic cells. It implements custom arithmetic pipelines for applications like financial modeling and scientific simulation. The 13 Mb block RAM reduces external memory traffic, while the 1.25 Gbps LVDS I/O enables high-bandwidth data exchange with host processors. The 28nm process balances performance and power efficiency.
推薦
Defense and Aerospace Systems
The XC7A200T-1FBG484I meets the demanding requirements of defense and aerospace applications with its industrial temperature range and robust 28nm process. The 740 DSP slices handle radar signal processing and electronic warfare algorithms, while the 285 I/O pins interface with various sensors and communication links. The FPGA's reconfigurability allows field updates to adapt to evolving mission requirements.
推薦
Video and Image Processing
The XC7A200T-1FBG484I processes high-resolution video streams with its 740 DSP slices and 13 Mb block RAM. It implements real-time filters, scaling, and compression algorithms for applications like surveillance and broadcasting. The 285 I/O pins support multiple video interfaces including LVDS and HSTL. The 10 CMTs generate pixel clocks for various video standards, ensuring synchronized output.
推薦
推薦產品摘要
工程參考資料，適用於 XC7A200T-1FBG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7A200T-1FBG484C | XC7A200T-2FBG484I | XC7A200T-3FBG484E | XC7A200T-1SBG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same | 484-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 215360 | 215360 | 215360 | 215360 | 215360 |
| DSP Slices | 740 | 740 | 740 | 740 | 740 |
| Block RAM | 13 Mb | 13 Mb | 13 Mb | 13 Mb | 13 Mb |
| User I/O | 285 | 285 | 285 | 285 | 285 |
| Speed Grade | -1 | -1 | -2 | -3 | -1 |
| Temperature Range | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +100C | -40C to +100C |
主要差異化特點
- Industrial temperature range (對比XC7A200T-1FBG484C)
- Balanced speed grade (對比XC7A200T-2FBG484I)
- High DSP density (對比XC7A200T-1SBG484I)
設計說明
The XC7A200T-1FBG484I requires multiple power rails: VCCINT at 0.95V-1.05V, VCCAUX at 1.8V, and VCCO for each I/O bank. Use low-impedance power distribution with dedicated voltage regulators for each rail. Follow AMD's recommended power sequencing: VCCINT first, then VCCAUX, then VCCO. Inadequate decoupling on VCCINT can cause configuration failures.
Place 0.1uF and 1uF decoupling capacitors close to each power pin on the 484-ball FCBGA package. Use a 4-layer or more PCB stackup with dedicated power and ground planes. For high-speed I/O, maintain controlled impedance traces and minimize via stubs. Follow AMD's PCB design guidelines in UG475 for optimal signal integrity.
The 484-ball FCBGA package has a thermal resistance of approximately 8-10 C/W (theta_JA) depending on airflow. At typical power dissipation of 5-10W, ensure adequate airflow or a heatsink to keep junction temperature below 100C. The industrial temperature range allows operation up to 100C ambient, but derating may be required at high utilization.
合規資訊
RoHS compliant per distributor listings. Not AEC-Q100 qualified as it is an FPGA, not an automotive-grade component.
