XC7A200T-2FBG484I - Artix-7 FPGA 215K Logic Cells | AMD Xilinx
MPN： XC7A200T-2FBG484I ✓ 啟用中| 數量 | 單價 | 小計 |
|---|---|---|
| 1 | $129.55 | $129.55 |
| 10 | $119.2 | $1,192.00 |
| 100 | $109.85 | $10,985.00 |
| 500 | $99.5 | $49,750.00 |
| 1,000 | $89.15 | $89,150.00 |
XC7A200T-2FBG484I 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that can be configured after manufacturing to implement custom digital circuits. FPGAs sit within the broader category of programmable logic devices (PLDs), which are part of the application-specific integrated circuit (ASIC) family, but offer reconfigurability that ASICs lack. The Artix-7 family is positioned as a mid-range FPGA optimized for cost-sensitive, high-volume applications requiring high-speed transceivers and DSP capabilities.
Key features include 740 DSP48E1 slices for high-throughput digital signal processing, 16 high-speed transceivers supporting up to 6.6 Gb/s, and 285 I/O pins with support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also integrates a PCIe Gen2 block, 10/100/1000 Ethernet MACs, and an analog-to-digital converter (XADC) for system monitoring. The -2 speed grade provides balanced performance for logic and I/O, while the industrial temperature range ensures reliable operation in harsh environments.
Architecturally, the XC7A200T is built on the 28nm high-k metal gate (HKMG) process, offering a 50% lower power footprint compared to previous generations. The configurable logic blocks (CLBs) contain 6-input look-up tables (LUTs) and dual flip-flops, enabling efficient implementation of complex logic functions. The device supports partial reconfiguration, allowing dynamic updates to specific regions without disrupting the entire design.
Typical applications include software-defined radio (SDR), medical imaging, industrial motor control, and high-performance computing acceleration. The high transceiver count and DSP resources make it particularly suited for communications infrastructure, such as LTE/5G base stations and network switches, where high-speed serial links and parallel processing are essential.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the FBG484 package has a thermal resistance of 8.4°C/W (theta_JA) that necessitates adequate airflow or heatsinking for high-utilization designs.
直接替換替代品，適用於 XC7A200T-2FBG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7A200T-2FBG484I （相同外形與佔位） — 差異在於 Package, Operating Temperature, Block RAM, Clock Management Tiles, DSP Slices.
快速比較工具 — 選擇替代零件進行並排比較：
XC7A200T-2FBG484C
✅ 直接替換✗ 缺貨
$320 / 單位
查看資料表 →XC7A200T-1FBG484I
✅ 直接替換✗ 缺貨
$38.5 / 單位
查看資料表 →XC7A200T-3FBG484I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7A200T-2FFG484I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7A200T-2FBG484I 最大額定值與電氣特性
| Family | Artix-7 |
| Number of Logic Elements/Cells | 215360 |
| Number of LABs/CLBs | 16825 |
| Total RAM Bits | 13455360 |
| Number of I/O | 285 |
| Number of DSP Slices | 740 |
| Number of Transceivers | 16 |
| Transceiver Speed | 6.6 Gb/s |
| 供應電壓 | 0.95 V to 1.05 V (nominal 1 V) |
| 工作溫度 | -40°C to +100°C |
| 封裝 | 484-BBGA, FCBGA (FBG484) |
| 安裝類型 | Surface Mount |
| Speed Grade | -2 |
| RoHS 狀態 | Compliant |
| Lead Free | Yes |
XC7A200T-2FBG484I 腳位配置
| 腳位 A1 | GND — Ground |
| 腳位 A2 | VCCO_0 — I/O bank 0 supply voltage |
| 腳位 A3 | IO_L1P_T0_0 — I/O pin, bank 0 |
| 腳位 B1 | VCCINT — Internal core supply voltage (1V) |
| 腳位 B2 | IO_L1N_T0_0 — I/O pin, bank 0 |
| 腳位 C1 | VCCAUX — Auxiliary supply voltage |
| 腳位 C2 | IO_L2P_T0_0 — I/O pin, bank 0 |
| 腳位 D1 | GND — Ground |
| 腳位 D2 | IO_L2N_T0_0 — I/O pin, bank 0 |
| 腳位 E1 | VCCO_0 — I/O bank 0 supply voltage |
| 腳位 E2 | IO_L3P_T0_0 — I/O pin, bank 0 |
| 腳位 F1 | VCCINT — Internal core supply voltage (1V) |
典型應用
XC7A200T-2FBG484I 適用於 6 應用s: Software-Defined Radio (SDR), Medical Imaging, Industrial Motor Control, High-Performance Computing Acceleration, Communications Infrastructure, Test and Measurement.
Software-Defined Radio (SDR)
The XC7A200T-2FBG484I is ideal for SDR applications due to its 16 high-speed transceivers (up to 6.6 Gb/s) and 740 DSP slices. These resources enable efficient digital down/up conversion, filtering, and modulation/demodulation. The 13.4 Mb of Block RAM supports large buffers for wideband signals. The industrial temperature range ensures reliable operation in field-deployed radios.
推薦
Medical Imaging
The XC7A200T-2FBG484I is well-suited for medical imaging systems like ultrasound and MRI, where high-speed data acquisition and processing are critical. Its 740 DSP slices handle beamforming and image reconstruction algorithms, while the 285 I/O pins interface with high-speed ADCs and DACs. The -2 speed grade provides the performance needed for real-time imaging.
推薦
Industrial Motor Control
The XC7A200T-2FBG484I is ideal for industrial motor control applications, offering 740 DSP slices for implementing complex control algorithms like FOC (Field-Oriented Control). Its 285 I/O pins interface with encoders, current sensors, and gate drivers. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments.
推薦
High-Performance Computing Acceleration
The XC7A200T-2FBG484I can accelerate compute-intensive workloads in HPC systems. Its 740 DSP slices and 13.4 Mb of Block RAM enable efficient implementation of custom arithmetic units and data pipelines. The 16 transceivers provide high-bandwidth connectivity to host processors or other FPGAs, making it suitable for data center accelerators.
推薦
Communications Infrastructure
The XC7A200T-2FBG484I is well-suited for communications infrastructure like LTE/5G base stations and network switches. Its 16 high-speed transceivers (up to 6.6 Gb/s) support CPRI, JESD204B, and 10GbE interfaces. The 740 DSP slices handle channel coding and equalization, while the 285 I/O pins interface with PHY devices and control planes.
推薦
Test and Measurement
The XC7A200T-2FBG484I is ideal for test and measurement equipment like oscilloscopes and logic analyzers. Its 285 I/O pins interface with high-speed ADCs and DACs, while the 740 DSP slices handle triggering, decimation, and waveform processing. The 13.4 Mb of Block RAM supports deep acquisition buffers, and the -2 speed grade ensures high sample rates.
推薦
推薦產品摘要
工程參考資料，適用於 XC7A200T-2FBG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7A200T-2FBG484C | XC7A200T-1FBG484I | XC7A200T-3FBG484I |
|---|---|---|---|---|
| Package | 484-BBGA, FCBGA (FBG484) | 484-BBGA, FCBGA (FBG484) - same | 484-BBGA, FCBGA (FBG484) - same | 484-BBGA, FCBGA (FBG484) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 215360 | 215360 | 215360 | 215360 |
| Block RAM (bits) | 13455360 | 13455360 | 13455360 | 13455360 |
| Number of I/O | 285 | 285 | 285 | 285 |
| Speed Grade | -2 | -2 | -1 | -3 |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C | -40°C to +100°C |
| Supply Voltage | 0.95V to 1.05V | 0.95V to 1.05V | 0.95V to 1.05V | 0.95V to 1.05V |
主要差異化特點
- Industrial temperature range (對比XC7A200T-2FBG484C)
- Higher speed grade (對比XC7A200T-1FBG484I)
- Balanced performance and cost (對比XC7A200T-3FBG484I)
設計說明
The XC7A200T-2FBG484I requires multiple voltage rails: VCCINT (1V), VCCAUX (1.8V), and VCCO (bank-specific). Proper power sequencing is critical to avoid latch-up or damage. Use a dedicated power management IC or FPGA power sequencer to ensure correct startup order. Decouple each rail with 100nF and 10uF capacitors placed close to the FPGA pins.
The FBG484 package has a thermal resistance of 8.4°C/W (theta_JA). For high-utilization designs, power dissipation can exceed 10W, requiring a heatsink or forced airflow. Calculate the junction temperature using Tj = Ta + (theta_JA * P) and ensure it stays below the maximum rated temperature of 100°C for industrial grade.
For the 484-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed transceiver signals with controlled impedance (e.g., 100 ohm differential for LVDS). Place decoupling capacitors as close to the FPGA as possible, and use via-in-pad for the thermal pad to improve heat dissipation.
合規資訊
RoHS compliant and lead-free per Micro-Semiconductor.com. Not AEC-Q100 qualified as it is an FPGA, not an automotive-grade component.
