10M08DCF484C8G - MAX 10 FPGA, 8K LEs, 484-BGA | Intel
MPN： 10M08DCF484C8G ✓ 啟用中10M08DCF484C8G 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure post-manufacture to implement custom digital circuits. MAX 10 FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) within the Intel/PSG portfolio, below Cyclone and above legacy MAX II/MAX V families. They integrate analog blocks (ADC), dual-configuration flash, and on-chip voltage regulators, bridging the gap between small CPLDs and high-density FPGAs.
Key features include 1.4 Gbps LVDS support, up to 16 global clocks with PLL phase shifting, 1.2 V core voltage operation, and dual-configuration flash allowing fail-safe field upgrades. The device integrates 2 PLLs, embedded 12-bit ADC blocks, and supports DDR3/DDR3L/LPDDR2 external memory interfaces via hardened memory controllers. Per-pin LVDS, emulated LVDS, and 1.0/1.2/1.5/1.8/2.5/3.3 V LVCMOS I/O standards are supported.
Architecturally, MAX 10 uses logic array blocks (LABs) of 16 logic elements each, with adaptive logic modules (ALMs) containing 8-input fracturable look-up tables (LUTs), dedicated carry chains, and register chains. The embedded flash is organized as two configuration sectors (CF0, CF1) plus dual-boot capability, enabling remote update without external components. User flash memory (UFM) is also accessible from the logic fabric for non-volatile parameter storage.
Typical applications include industrial motor control, factory automation PLCs, video bridging and protocol conversion, low-cost ASIC replacement, and embedded control with on-board analog sensing. The integrated 12-bit ADC and instant-on flash make it particularly attractive for system-on-module (SoM) designs where BOM minimization matters.
When designing with this device, ensure the Quartus Prime software version supports the -C8 speed grade timing models, and validate pinout assignments against the 484-FBGA ball map. Thermal management is critical: at full toggle rate the device can dissipate several watts, requiring adequate copper on the PCB.
This page consolidates distributor pricing, drop-in same-package alternatives, and Quartus Prime design considerations not present in the standalone datasheet - saving engineers BOM validation time.
直接替換替代品，適用於 10M08DCF484C8G — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10M08DCF484C8G （相同外形與佔位） — 差異在於 Package, Operating Temperature, Process Technology, Speed Grade, Core Voltage.
10M08DAF484C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08DAF484I7G
✅ 直接替換聯絡詢價
查看資料表 →10M08DAF484I7P
✅ 直接替換聯絡詢價
查看資料表 →10M08DAU324C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08DCF256C8G
✅ 直接替換聯絡詢價
查看資料表 →10M08DCF256I7G
✅ 直接替換聯絡詢價
查看資料表 →10M08DCF484C8G 最大額定值與電氣特性
| Family | MAX 10 |
| Logic Elements | 8,000 |
| Embedded Memory (M9K) | 378 Kbits (49 M9K blocks) |
| User I/O Count | 250 |
| 封裝 | 484-ball FBGA (FineLine BGA) |
| Speed Grade | C8 (commercial, standard speed) |
| Process Technology | 55 nm TSMC embedded NOR flash |
| Core Voltage | 1.2 V (on-chip regulator) |
| Configuration Memory | Dual on-chip flash (instant-on, dual-boot) |
| PLLs | 2 |
| Global Clock Networks | Up to 16 |
| Integrated ADC | 12-bit SAR, up to 1 Msps |
| LVDS Support | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) |
| 工作溫度 | Commercial (0C to +85C junction, per speed grade) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
10M08DCF484C8G 484-ball fbga (fineline bga) 腳位配置指南
10M08DCF484C8G（484-ball fbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10M08DCF484C8G.
請參閱 資料表 以查看完整腳位配置。
典型應用
10M08DCF484C8G 適用於 6 應用s: Industrial Motor Control, Factory Automation PLC, Video Bridging and Protocol Conversion, Low-Cost ASIC Replacement, Embedded Control with Analog Sensing, System-on-Module (SoM) FPGA Hub.
Industrial Motor Control
The 10M08DCF484C8G is well-suited for industrial motor control applications requiring deterministic PWM generation and closed-loop feedback. Its 8,000 logic elements and 2 PLLs deliver enough fabric to implement field-oriented control (FOC) algorithms for BLDC and PMSM motors at switching frequencies up to 100 kHz. The integrated 12-bit SAR ADC (when paired with the DA variant) directly samples phase currents, eliminating an external ADC. The 484-FBGA package exposes 250 user I/O for multi-axis encoder inputs, gate driver signals, and CAN/RS-485 communication. The dual-configuration flash enables fail-safe firmware updates in the field, and the on-chip regulator simplifies 24V industrial bus designs down to a 1.2V core.
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Factory Automation PLC
In factory automation PLC designs the 10M08DCF484C8G acts as the central logic processor for distributed I/O control. Its 8,000 logic elements accommodate ladder-logic-equivalent state machines for multi-axis sequencing, while the 250 I/O support high-density discrete and analog I/O modules via SPI/I2C/GPIO expansion. The instant-on dual-configuration flash is critical for PLCs that must come back online within milliseconds after a power dip, eliminating PROM boot delays. Hardware access to DDR3/LPDDR2 controllers simplifies integration with HMI displays. Industrial protocol stacks (Modbus RTU, EtherCAT slave, PROFINET IRT) can be implemented in fabric, often with the free Qsys IP blocks.
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Video Bridging and Protocol Conversion
For video bridging applications the 10M08DCF484C8G converts between MIPI CSI-2, parallel RGB, and LVDS display interfaces commonly found in industrial cameras and embedded displays. Its 1.4 Gbps LVDS receivers handle camera link data rates up to 1.4 Gbps per lane, while the emulated LVDS outputs can drive flat-panel displays. With 8K logic elements and 49 M9K memory blocks, the device fits a full-frame buffer plus color-space conversion pipelines (YUV422 to RGB888, etc.). The C8 commercial speed grade and 250 I/O are sufficient for multi-lane camera aggregation, and the on-chip flash eliminates the boot ROM that would otherwise be required for instant-on video systems.
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Low-Cost ASIC Replacement
The 10M08DCF484C8G is a strong candidate for low-volume ASIC replacement where NRE costs and mask charges would be prohibitive. With 8K logic elements, 378 Kbits embedded memory, and instant-on flash, the device covers the majority of glue-logic, interface conversion, and simple state-machine designs that historically went to ASICs. The 484-FBGA package delivers 250 I/O - matching ASIC-class signal density. Quartus Prime's free Qsys IP catalog and migration to MAX 10 HardCopy ASIC provide a clear path from prototype to volume production. Engineering teams can iterate in firmware (flash update) rather than re-spinning masks.
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Embedded Control with Analog Sensing
When paired with the ADC-enhanced 10M08DAF484C8G variant, this FPGA family enables embedded control designs with on-die analog sensing. The integrated 12-bit SAR ADC samples up to 17 analog inputs at 1 Msps, covering temperature sensors, current shunts, and battery voltages without an external ADC chip. The 8K logic elements run control algorithms (PID, state machines, safety logic) at deterministic latency. The dual-configuration flash supports secure OTA updates, and the 1.2 V on-chip regulator simplifies power tree design. For systems needing only digital control (no ADC), the 10M08DCF484C8G is the canonical choice.
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System-on-Module (SoM) FPGA Hub
As an SoM hub, the 10M08DCF484C8G consolidates glue logic that would otherwise require multiple CPLDs and small FPGAs. Common SoM tasks include boot strapping for application processors, level shifting between 1.8 V SoC and 3.3 V peripherals, I2C/SPI bus expansion, and GPIO aggregation. Its 8K logic elements and 250 I/O are well-matched to multi-rail SoM pinouts. The instant-on dual-configuration flash enables the SoM to be running before the application processor boots, ready to handle reset signals. The 484-FBGA's compact footprint supports dense SoM layouts where PCB real estate is at a premium.
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推薦產品摘要
工程參考資料，適用於 10M08DCF484C8G — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10M08DAF484C8G | 10M08DAF484I7G | 10M08DAF484I7P | 10M08DAU324C8G | 10M08DCF256C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 324-ball UBGA - different footprint | 256-ball FBGA - different footprint |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| User I/O | 250 | 250 | 250 | 250 | ~150 | ~178 |
| Speed Grade | C8 (commercial, standard) | C8 (commercial, standard) | I7 (industrial, standard) | I7 (industrial, standard) | C8 (commercial, standard) | C8 (commercial, standard) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Configuration Flash | Dual (DC series) | Dual (DA series, no dual-config) | Dual (DA series, no dual-config) | Dual (DA series, no dual-config) | Dual (DA series, no dual-config) | Dual (DC series) |
| Integrated ADC | No (DC = no analog) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | No |
主要差異化特點
- Highest I/O count in the MAX 10 8K LE bracket (對比10M08DCF256C8G)
- Dual-configuration flash for field upgrades (對比10M08DAF484C8G)
- Lower BOM cost vs ADC-equipped variant (對比10M08DAF484C8G)
設計說明
The MAX 10 family uses an on-chip linear regulator to generate the 1.2 V core from a single 2.5 V or 3.3 V external supply. Designers must connect VCCAUX (2.5 V) and VCCIO (per bank I/O standard) - omitting VCCAUX prevents configuration. Power sequencing is not required because the internal regulator ramps the core before the I/O banks come out of reset, but bulk capacitance of at least 22 uF near each VCC pin is recommended.
Estimated: at full logic utilization (8K LEs at ~150 MHz toggle rate), the 10M08DCF484C8G can dissipate 1.0-1.5 W. With theta_JA of approximately 20 C/W for the 484-FBGA (Intel package thermal data, application-specific), the junction-to-ambient temperature rise is 20-30 C above ambient. For enclosed industrial enclosures with limited airflow, design 1 square inch of inner-layer copper directly beneath the BGA thermal balls to stay within the commercial 85 C junction limit.
The 484-ball FBGA uses a 1.0 mm ball pitch. Per IPC-7351 guidelines, breakout routing requires 4 signal layers minimum (2 outer + 2 inner) with 0.10 mm via-in-pad recommended for ground balls and signal balls. Use dog-bone fanout for the inner rows to maintain a manufacturable trace width. Decoupling: 0.1 uF X7R + 4.7 uF X5R per VCCIO bank pin, plus 22 uF bulk per supply rail.
Common pitfalls with MAX 10 designs include: (1) selecting the wrong speed grade - C8/I8 are the slowest but most affordable, C7/I7 are premium; (2) using a 256-ball part when 250 I/O are required - confirm I/O count fits the package ball map before PCB layout; (3) forgetting to program the dual-configuration boot address when designing for field firmware upgrades; (4) not enabling the JTAG pin pull-ups during PCB design - leaving them floating causes programming failures.
合規資訊
RoHS and lead-free per Intel product page. Halogen-free per MAX 10 family datasheet. Not AEC-Q100 qualified - this is a commercial/industrial grade part. For automotive designs refer to Intel's Cyclone IV/10 GX automotive variants.