10M08DCF484C8G vs 10M08DAF484I7P 比較
詳細並排比較 10M08DCF484C8G 由 Intel 與 10M08DAF484I7P 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M08DCF484C8G | 10M08DAF484I7P |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 8,000 | — |
| Embedded Memory (M9K) | 378 Kbits (49 M9K blocks) | — |
| Embedded Multiplier Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 250 | 250 |
| 封裝 | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (F484) |
| Speed Grade | C8 (commercial, standard speed) | -7 |
| Process Technology | 55 nm TSMC embedded NOR flash | — |
| Core Voltage | 1.2 V (on-chip regulator) | 1.0 V |
| Configuration Memory | Dual on-chip flash (instant-on, dual-boot) | — |
| PLLs | 2 | 4 |
| Global Clock Networks | Up to 16 | — |
| Integrated ADC | 12-bit SAR, up to 1 Msps | — |
| LVDS Support | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) | — |
| 工作溫度 | Commercial (0C to +85C junction, per speed grade) | -40 C to +100 C (Industrial) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: moisture sensitivity level] |
| RoHS 狀態 | Compliant | Compliant |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory | — | 378 Kbits (46,080 M9K bits) |
| Pitch | — | 1.0 mm |
| On-chip Configuration Flash | — | Yes, dual-boot |
| Embedded ADC | — | 12-bit, 1 Msps, 16 channels |
| DSP Blocks | — | Yes (24 x 18-bit multipliers) |
| Maximum LVDS Channels | — | [DATA_NEEDED: per-bank LVDS channel count] |
| User Flash | — | 8 Kbits (non-volatile) |