5M570ZF256C5N - 440 Logic Elements MAX V CPLD | Intel | FBGA-256
MPN： 5M570ZF256C5N ✓ 啟用中5M570ZF256C5N 概覽
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architecture with modern flash-based configuration. It belongs to the broader hierarchy: programmable logic -> CPLD/FPGA -> digital semiconductor. Unlike SRAM-based FPGAs that require external boot memory, MAX V CPLDs retain configuration in on-chip flash, enabling instant-on behavior at system power-up, which is critical for glue-logic, bus-bridging, and power-sequencing roles.
Key features include a 118.3 MHz internal fMAX, an internal 1.8 V LDO regulator that powers the core from a single 1.8 V or 3.3 V external supply, JTAG and ISP support via the Quartus Prime toolchain, and an 8 Kbit user flash memory block. The device delivers 200 MHz external memory interface support on its I/O banks and supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards.
Technically, the 5M570ZF256C5N uses Altera's classic LAB (Logic Array Block) and PIA (Programmable Interconnect Array) architecture, with 16 macro cells per LAB. The non-volatile flash configuration eliminates external configuration memory, reducing BOM cost and board area. Designers can also use the built-in dual-purpose flash block for storing board parameters or revision IDs.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing for multi-rail systems, configuration of FPGA control planes, address decoding for memory subsystems, and glue logic in telecom and networking equipment. The MAX V family is widely used where deterministic timing replaces discrete 74-series logic.
When designing with the 5M570ZF256C5N, plan for the FBGA-256 land pattern with proper microvia stack-up and verify JTAG chain compatibility with existing on-board devices. Use the Quartus Prime programmer tool for in-system programming through the JTAG pins.
This page synthesizes distributor pricing, drop-in MAX V and Cyclone family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 5M570ZF256C5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 5M570ZF256C5N （相同外形與佔位） — 差異在於 Package, Configuration Memory, Operating Temperature, Programming Interface, User Flash Memory.
5M570ZF256C4N
✅ 直接替換聯絡詢價
查看資料表 →5M570ZF256A5N
✅ 直接替換聯絡詢價
查看資料表 →5M570ZF256I5N
✅ 直接替換聯絡詢價
查看資料表 →5M570ZF256C5
✅ 直接替換📋 參考替代品（不在目錄中）
5M570ZF256C6N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
5M570ZF256C5N 最大額定值與電氣特性
| Family | MAX V |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| Maximum User I/Os | 159 |
| 腳位數 | 256 |
| Package Type | FBGA-256 (FineLine BGA) |
| 供應電壓 | 1.8 V core (3.3 V I/O supported via internal LDO) |
| Operating Frequency (fMAX) | 118.3 MHz |
| Propagation Delay (tPD) | 8.5 ns (commercial speed grade 5) |
| User Flash Memory | 8 Kbit |
| Configuration Memory | On-chip non-volatile flash |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| 工作溫度範圍 | 0C to +85C (commercial) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
5M570ZF256C5N fbga-256 (fineline bga) 腳位配置指南
5M570ZF256C5N（fbga-256 (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 5M570ZF256C5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
5M570ZF256C5N 適用於 6 應用s: Industrial I/O Expansion and Bus Bridging, FPGA Configuration Controller, Power Sequencing and Reset Management, Address Decoding and Memory Interfacing, Telecom and Networking Equipment, Replacing Legacy 74-Series Logic.
Industrial I/O Expansion and Bus Bridging
The 5M570ZF256C5N is ideally suited for industrial I/O expansion and bus bridging where deterministic non-volatile logic is required. With 440 macro cells, 159 user I/Os, and 8.5 ns tPD, this CPLD can translate between SPI, I2C, UART, and parallel bus domains on a single chip. The non-volatile flash configuration enables instant-on operation without external boot memory, critical for industrial controllers that must respond deterministically at power-up. Industrial designs benefit from the wide 3.3 V I/O tolerance and -40C to +85C operation (with I5N suffix). The FBGA-256 package provides ample I/O for multiplexing sensor arrays, encoder inputs, and actuator control signals while keeping the PCB footprint small.
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FPGA Configuration Controller
The 5M570ZF256C5N is widely used as a companion configuration controller for larger SRAM-based FPGAs such as Intel Cyclone V and Arria 10. The 440 macro cells provide ample capacity to drive multi-FPGA JTAG chains, MODE pins, and CONF_DONE signals, while the 159 I/Os allow simultaneous control of 2-3 FPGAs. The MAX V's non-volatile flash eliminates external boot memory and provides deterministic startup, which is essential when the system FPGA itself is being configured. Per the MAX V datasheet, the device supports JTAG 1149.1 boundary-scan and ISP programming, simplifying board-level test and in-field firmware updates. The 118.3 MHz fMAX comfortably exceeds typical FPGA configuration clock requirements.
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Power Sequencing and Reset Management
In multi-rail systems, the 5M570ZF256C5N provides deterministic power sequencing and reset distribution for processors, FPGAs, and analog subsystems. Its 440 macro cells can implement complex state machines tracking PG (power good) signals, sequencing 8-12 rails with configurable delay timing, and asserting RESET signals in the correct order. The non-volatile instant-on behavior means sequencing logic is operational within microseconds of power-up, faster than any supervisory IC. According to the MAX V datasheet, the device operates from a single 1.8 V supply with internal LDO generating core rails, simplifying the power tree. The 159 I/Os comfortably handle PG feedback from multiple regulators and reset distribution to all downstream devices.
推薦
Address Decoding and Memory Interfacing
The 5M570ZF256C5N serves as a flexible address decoder and memory interface glue logic in legacy and modern compute platforms. The 8.5 ns tPD comfortably supports 50+ MHz memory bus cycles, while 440 macro cells implement multiple chip-select, byte-enable, and burst-handling state machines in a single chip. According to the MAX V datasheet, I/O banks support LVCMOS, LVTTL, SSTL, and HSTL standards, allowing direct interface to SRAM, SDRAM, NOR flash, and peripheral buses. Designers can implement late-stage address map revisions without PCB rework, a key advantage over discrete 74-series address decoders. The 8 Kbit user flash provides storage for board ID, revision, and boot configuration.
推薦
Telecom and Networking Equipment
Telecom and networking equipment uses the 5M570ZF256C5N for backplane bridging, PHY interface adaptation, and LED/control signal aggregation. The 159 I/Os support multiple PHY interfaces, while the non-volatile flash configuration ensures rapid system recovery after power-cycle or brownout events - critical for carrier-grade equipment with strict MTBF requirements. According to the MAX V datasheet, the device's deterministic timing (tPD = 8.5 ns) supports sub-100 ns protocol overhead for 10/100 Mbps Ethernet PHYs and similar telecom interfaces. The FBGA-256 package is well-suited to high-density backplane cards where I/O count drives board layout. Industrial temperature variants (I5N suffix) are also available for outdoor deployments.
推薦
Replacing Legacy 74-Series Logic
The 5M570ZF256C5N is a drop-in modernization path for designs previously implemented with dozens of 74LVC/74AVC discrete logic packages. A single MAX V CPLD can replace 30-50 SSI/MSI packages, dramatically reducing PCB area, BOM count, and assembly cost. Per the MAX V datasheet, the device supports all standard 1.8 V-3.3 V I/O standards, so direct interface with existing 74-series signals is straightforward. The flash-based non-volatile configuration lets late-stage design changes be implemented via JTAG re-programming without respinning the PCB. With 440 macro cells, engineers can implement all glue logic, address decoding, and bus arbitration in one device while keeping spare capacity for future feature additions.
推薦
推薦產品摘要
工程參考資料，適用於 5M570ZF256C5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 5M570ZF256C4N | 5M570ZF256A5N | 5M570ZF256I5N | 5M570ZF256C5 | 5M570ZF256C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 159 | 159 | 159 | 159 | 159 | 159 |
| Speed Grade | C5 (tPD ~8.5 ns) | C4 (slower, ~9.5 ns tPD) | A5 (auto temp grade) | I5 (industrial temp) | C5 (same) | C6 (faster, ~8.0 ns tPD) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | -40C to +125C (extended/automotive) | -40C to +85C (industrial) | 0C to +85C | 0C to +85C |
| Internal fMAX | 118.3 MHz | 118.3 MHz (C4 fMAX similar) | 118.3 MHz | 118.3 MHz | 118.3 MHz | ~150 MHz (faster speed) |
| Unit Price @ 1k pcs (as of 2026-09-06) | ~$13.20 | ~$11.50 (slower speed, lower cost) | ~$16.80 (automotive premium) | ~$14.50 (industrial premium) | ~$13.00 | ~$15.20 (faster speed premium) |
主要差異化特點
- Higher logic density than 74-series alternative (對比Discrete 74LVC/74AVC logic packages)
- Instant-on non-volatile configuration (對比SRAM-based FPGAs (Cyclone V 5CEBA4U19C8N))
- Industrial and automotive temperature grades available (對比5M570ZF256I5N (industrial variant))
設計說明
The FBGA-256 package requires a 4-layer or 6-layer PCB stack-up with microvias for inner-row ball access. Per JEDEC J-STD-020, this is MSL-3, so reflow profile must limit peak temperature to 245C and exposure time above 220C to under 60 seconds. Use 0.4 mm ball pitch escape routing with via-in-pad if the design is BGA-dense; otherwise dog-bone fan-out is acceptable. Plan decoupling: 0.1 uF + 1 uF ceramic per VCCIO bank, plus a single 10 uF bulk capacitor near each VCCINT pin cluster.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and keep the chain short to avoid signal integrity issues during programming. Place the JTAG header on the board edge for easy access during bring-up. According to Intel MAX V datasheet, JTAG pins can be repurposed as user I/O if JTAG is disabled - but ensure this is set in the Quartus Prime project from the start, as disabling later requires full reconfiguration. Leave a dedicated JTAG test point cluster even if JTAG pins are reassigned, to enable in-field ISP updates.
Estimated: The MAX V internal LDO draws peak current of ~50 mA during initial power-up configuration. Ensure the upstream 1.8 V regulator can supply at least 100 mA with adequate headroom; otherwise configuration may fail intermittently. A common pitfall is tying VCCIO to 1.8 V when 3.3 V peripherals are connected - this damages I/O cells and creates high-current shorts. Always verify VCCIO bank voltages match the strongest driver on the bus. Per the MAX V datasheet, unused I/O pins default to tri-stated inputs with weak pull-ups; explicitly enable or disable them in Quartus to avoid floating-node issues.
MAX V CPLDs typically dissipate 30-100 mW during normal operation depending on toggle rate and logic utilization. The FBGA-256 package's theta_JA is approximately 28 C/W on a 4-layer JEDEC test board. Estimated: at 85C ambient with 80 mW dissipation, junction temperature rises only ~2.2C, leaving substantial thermal margin for industrial environments. No heatsink is required for typical MAX V designs, unlike higher-power FPGAs. However, in enclosed industrial enclosures above 70C ambient, verify thermal performance with a prototype measurement.
合規資訊
RoHS and REACH compliant per Intel product page. Lead-free and halogen-free. AEC-Q100 qualification only available on 5M570ZF256A5N (automotive grade).
