5M570ZF256I5N - MAX V CPLD 440 Logic Elements FBGA-256 | Intel
MPN: 5M570ZF256I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.1 | $16.10 |
| 10 | $14.5 | $145.00 |
| 100 | $12.95 | $1,295.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $10.26 | $10,260.00 |
Drop-in alternatives for 5M570ZF256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M570ZF256C5N
✅ Drop-In✓ In Stock
$13.2 / Unit
View Datasheet →5M570ZF256C4N
✅ Drop-In✓ In Stock
$6.42 / Unit
View Datasheet →5M570ZF256A5N
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →5M570ZF256I5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device Type | CPLD - Complex Programmable Logic Device |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Maximum User I/Os | 159 |
| User Flash Memory | 8 Kbits (8192 bits) |
| Pin-to-Pin Propagation Delay (tPD1) | 7.0 ns |
| Maximum Internal Frequency | 118.3 MHz |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) |
| MultiVolt I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Operating Temperature Range (I grade) | -40 °C to +100 °C (industrial) |
| I/O Drive Strength | 4 mA |
| Internal Oscillator | 3.33 MHz |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Package | 256-ball FBGA (FineLine BGA), 17 mm × 17 mm |
| Mounting Type | Surface Mount (SMT) |
| Configuration Memory | Non-volatile flash (instant-on) |
| RoHS Status | Compliant |
5M570ZF256I5N 256-ball fbga (fineline bga), 17 mm × 17 mm Pin Configuration Guide
Complete pinout information for 5M570ZF256I5N (256-ball fbga (fineline bga), 17 mm × 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M570ZF256I5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M570ZF256I5N is suitable for 6 applications: I/O Expansion and Level Translation, Power-Up / Power-Down Sequencing, Bus Bridging and Protocol Conversion, LED Display Multiplexing and Signage, Industrial Control Logic Replacement (74-Series Glue), Networking Equipment Glue Logic.
I/O Expansion and Level Translation
The 5M570ZF256I5N is well suited to I/O expansion and voltage-level translation between modern 1.8 V application processors and legacy 3.3 V peripherals. Its MultiVolt I/O banks natively support 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails on a per-bank basis, eliminating external level-shifters in mixed-voltage designs. The 159 user I/Os in FBGA-256 provide ample headroom to expose GPIOs, SPI, I2C, UART, and PWM channels that the host SoC lacks. Deterministic 7.0 ns tPD1 timing means handshake and interrupt latencies are predictable, which is critical for real-time control loops and industrial HMI panels. Pair it with a low-cost microcontroller (e.g., STM32G0 or PIC16) on the 3.3 V side for a robust, BOM-light bridge.
Recommended
Power-Up / Power-Down Sequencing
Multi-rail systems (FPGA + DDR + SerDes + analog) require strict power-rail sequencing to avoid latch-up and in-rush damage. The 5M570ZF256I5N's non-volatile flash configuration means the device is fully active the moment VCCINT crosses 1.71 V, with no external boot PROM or FPGA bitstream load delay. Its 8 Kbits of user flash and 440 macro cells are sufficient to host PG (power-good) arbiter logic, watchdog timers, and MOSFET gate-driver pulse generation. The industrial –40 °C to +100 °C temperature range supports telecom, server, and industrial chassis deployments. Compared to a sequencer ASIC, the CPLD offers field-upgradable sequencing firmware via JTAG and provides 159 I/Os to control dozens of rails in high-end systems.
Recommended
Bus Bridging and Protocol Conversion
The 5M570ZF256I5N bridges incompatible bus protocols between legacy microcontrollers and modern SoCs — for example, parallel 8/16-bit SRAM to AXI, I2C to SPI, or UART to I2S. The 118.3 MHz maximum internal frequency is more than adequate to clock-shift up to 80 Mbps serial streams while leaving headroom for state-machine logic. The 256-ball FBGA package exposes the I/O density needed to terminate wide buses (e.g., 16-bit SRAM plus control plus interrupts) without external mux/demux chips. Non-volatile configuration ensures the bridge is functional at power-on, eliminating any boot-time communication dead zones. This makes it popular in industrial PLCs, telecom line cards, and aftermarket automotive infotainment adapters.
Recommended
LED Display Multiplexing and Signage
Large LED matrix displays (stadium scoreboards, transit signage, retail video walls) require precise row/column multiplexing with no visible flicker. The 5M570ZF256I5N's deterministic 7 ns pin-to-pin delay and 118.3 MHz internal frequency easily drive 32+ row scans at 1 kHz refresh rates without row-to-row timing skew. Its 159 user I/Os are sufficient to drive column drivers directly through 4 mA current-limited outputs or to feed external MOSFET drivers for high-current panels. The non-volatile configuration removes any startup flicker that would otherwise reveal the boot process. The industrial temperature range supports outdoor and semi-outdoor deployments, while FBGA-256 keeps the PCB compact behind tight LED driver pitch.
Recommended
Industrial Control Logic Replacement (74-Series Glue)
The 5M570ZF256I5N replaces dozens of 74HC/74AHC glue-logic ICs (latches, muxes, decoders, AND/OR gates) on legacy industrial PCBs, reducing BOM count and improving reliability. With 440 LEs and 8 Kbits user flash, one CPLD can implement a full board's worth of decode, latch, and interrupt-aggregation logic in a single 17 × 17 mm FBGA-256 package. Industrial –40 °C to +100 °C operation and MultiVolt I/O make it ideal for 24 V factory-automation backplanes that mix 3.3 V controllers with 5 V peripheral logic. The JTAG interface (IEEE 1149.1) simplifies boundary-scan testing for manufacturing. Existing 74-series designs can be ported with Quartus Prime synthesis at zero NRE cost.
Recommended
Networking Equipment Glue Logic
Routers, switches, and small-cell base stations use the 5M570ZF256I5N for PHY-to-MAC interface glue, MDIO/SMI bus arbitration, fan-speed control, and front-panel LED management. The 159 user I/Os support multi-port Gigabit Ethernet designs where each PHY requires MDC/MDIO plus interrupt plus reset/clock-enable signals. CPLDs in this role outperform microcontrollers because their deterministic timing guarantees PHY reset and strap-pin sequencing without RTOS jitter. The 7 ns tPD1 timing accommodates 25 MHz MDC clocks with comfortable margin. Industrial temperature and long-life Intel supply commitment make it attractive for carrier-grade equipment with 10+ year field-deployment horizons.
Recommended
Recommended Products Summary
Engineering reference data for 5M570ZF256I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M570ZF256C5N | 5M570ZF256C4N | 5M570ZF256A5N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Logic Elements | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 159 | 159 | 159 | 159 |
| tPD1 (Pin-to-Pin Delay) | 7.0 ns | 7.0 ns | ~7.5 ns | 7.0 ns |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | Automotive / extended grade |
| Core Supply (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Approx. Unit Price (qty 1000) | $10.26 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density MAX V CPLD with 159 user I/Os in a single FBGA-256 package (vs 5M2210ZF256I5N)
- Industrial temperature grade with no price premium vs commercial (vs 5M570ZF256C5N)
- Non-volatile flash configuration enables true instant-on at power-up (vs SRAM-based FPGAs (e.g. Cyclone IV E))
Design Notes
The FBGA-256 package on the 5M570ZF256I5N is a 1.0 mm-pitch FineLine BGA, 17 × 17 mm. Use IPC-7351 microvia-compatible land patterns with NSMD (non-solder-mask-defined) pads to maximize pad-to-pad spacing and improve assembly yield. Place at least four via-in-pad thermal vias under the BGA thermal balls to a continuous inner ground plane; this lowers junction-to-ambient thermal resistance and reduces the BGA reball risk during lead-free reflow. Estimated: a fully-populated 4-layer FR-4 board with 9 thermal vias under the thermal balls typically achieves θJA in the 20–25 °C/W range (manufacturer datasheet figure used as reference).
Do not confuse MAX V 'I-suffix' industrial-grade devices with 'A-suffix' automotive-grade devices: the 5M570ZF256I5N is rated to –40 °C to +100 °C, while the 5M570ZF256A5N covers the extended automotive temperature profile. Using the wrong grade in an automotive under-hood or outdoor enclosure design will result in timing drift and potential logic errors below 0 °C. Also note that 5M570ZF256C5N is commercial grade only (0 °C to +85 °C) and is NOT a drop-in for industrial-temperature designs even though it shares the same FBGA-256 footprint.
JTAG signals (TCK, TMS, TDI, TDO, TRST) must be routed as a bus with matched lengths within ~50 mils to preserve signal integrity at typical 10–33 MHz TCK rates. Add 10 kΩ pull-ups on TCK, TMS, TDI and a 10 kΩ pull-down on TRST for stable boundary-scan operation. Decouple every VCCINT/VCCIO pin pair with a 0.1 µF X7R ceramic capacitor placed within 2 mm of the ball, plus a single bulk 10 µF tantalum or polymer capacitor per voltage rail. For MultiVolt bank mixing, keep noisy switching I/O on separate VCCIO banks from sensitive clock or analog-adjacent signals.
Compliance Information
RoHS and REACH compliance per Intel MAX V family product page. Industrial temperature grade (I-suffix) supports –40 °C to +100 °C. AEC-Q100 qualification not applicable for this industrial-grade CPLD; for automotive AEC-Q100 designs use 5M570ZF256A5N.
